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Trending Companies
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Trending Technologies
EUV585 3nm552 AI195 GPU172 AI chips144 HBM128 DRAM81 memory chips69 RTX Spark65 CPU64 GaN52 AI infrastructure49 LPDDR5X44 SiC40 semiconductor38
2026-05-17
Cadence Design Systems stock: Chip design software demand stays in focus - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-17 AD HOC NEWS
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2026-05-17
Arizona State Retirement System Sells 219,895 Shares of NVIDIA Corporation $NVDA - MarketBeat
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www.marketbeat.com 2026-05-17 MarketBeat
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2026-05-17
Cerebras Systems IPO Raises $5.5 Billion in One of the Largest Semiconductor Offerings - News and Statistics - IndexBox
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www.indexbox.io 2026-05-17 IndexBox
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2026-05-17
Tata signs MoU with ASML to develop semiconductor ecosystem in India - Crypto Briefing
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cryptobriefing.com 2026-05-17 Crypto Briefing
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2026-05-17
Infineon's AI-Powered Surge Hits Technical Ceiling as Overbought Signals and Insider Sale Temper Ent - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-17 AD HOC NEWS
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2026-05-16
Can India Build an Advanced Semiconductor Packaging Ecosystem? - Bisinfotech
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www.bisinfotech.com 2026-05-16 Bisinfotech
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2026-05-16
Tata Electronics and ASML Announce Strategic Partnership to Advance the Semiconductor Manufacturing Ecosystem in India - Tata Electronics
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www.tataelectronics.com 2026-05-16 Tata Electronics
ASML will enable the establishment and ramp-up of Tata Electronics’ Dholera Fab with its holistic suite of lithography tools and solutionsThe partnership will accelerate training of local talent, lithography intensive skill development, as well as proactive supply chain resilienceGiven the importance of lithography in chip manufacturing, the companies will develop the R&D infrastructure critical f
Semiconductor ManufacturingIndia SemiconductorASML PartnershipTata ElectronicsDholera FabLithography TechnologySupply Chain ResilienceTalent Development
2026-05-16
Infineon Reshapes Business Around AI-Powered Power Systems as Auto Margins Slip, Shares Cool From Ra - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-16 AD HOC NEWS
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2026-05-16
Nebius Group, Cisco Systems, Micron Technology And More: 5 Stocks Investors Couldn't Stop Buzzing About This Week - Benzinga
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www.benzinga.com 2026-05-16 Benzinga
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2026-05-16
Qsemble Capital Management LP Invests $5.36 Million in Cadence Design Systems, Inc. $CDNS - MarketBeat
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news.google.com 2026-05-16 MarketBeat
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2026-05-16
Phoenix Financial Ltd. Decreases Stock Holdings in Cadence Design Systems, Inc. $CDNS - MarketBeat
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www.marketbeat.com 2026-05-16 MarketBeat
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2026-05-16
TSMC To Reduce Stake in Taiwanese Foundry Vendor - Semiecosystem
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marklapedus.substack.com 2026-05-16 Semiecosystem
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2026-05-16
KLA Corporation, Monolithic Power Systems, onsemi, Semtech, and Lattice Semiconductor Stocks Trade Down, What You Need To Know - StockStory
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stockstory.org 2026-05-16 StockStory
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2026-05-15
Cadence Design Systems stock (US12541W1027): AI and chip design momentum after latest earnings - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-15 AD HOC NEWS
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2026-05-15
Infineon adds 2300 V SiC modules for energy systems ... - eeNews Europe
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www.eenewseurope.com 2026-05-15 eeNews Europe
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2026-05-15
UMC Rolls Out 14nm FinFET Process For Display ICs - Semiecosystem
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marklapedus.substack.com 2026-05-15 Semiecosystem
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2026-05-15
Cerebras Systems Stock Soars 68% in Blockbuster IPO: What Investors Should Know - The Motley Fool
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www.fool.com 2026-05-15 The Motley Fool
On Thursday,Cerebras Systems(CBRS+5.87%)soared 68.2% in its debut on the Nasdaq stock exchange. The artificial intelligence (AI) chipmaker'sinitial public offeringwas the largest IPO in 2026 so far. That title, however, may be lost if Elon Musk's SpaceX goes public this year, as widely expected.Here's what investors should know.Cerebras' wafer-scale AI chip. Image source: Cerebras Systems.Cerebras
AI chipIPOSemiconductorArtificial IntelligenceCerebras SystemsNVIDIASpaceXMarket valuation
2026-05-14
Cadence Design Systems, Inc. $CDNS is Freemont Management S.A.'s 9th Largest Position - MarketBeat
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www.marketbeat.com 2026-05-14 MarketBeat
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2026-05-14
Cadence Design Systems (NASDAQ:CDNS) Q1 Earnings: Leading The Design Software Pack - The Globe and Mail
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www.theglobeandmail.com 2026-05-14 The Globe and Mail
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2026-05-14
Chiplets Need A New Workflow
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semiengineering.com 2026-05-14 Ann Mutschler
Multi-die assemblies are facing full system-level challenges, but engineering teams nee...
ChipletsSystem-level designAdvanced packagingMulti-physics simulationAI in chip designReliability engineeringDesign flow2.5D/3D architecture