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Semiconductor News & Analysis Feed

20 articles
2026-09-26
SCHMID surges after Nvidia, AMD, Intel consider using glass substrates in chips - Seeking Alpha
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seekingalpha.com 2026-09-26
2026-09-26
Intel High-NA EUV: Panther Lake and Stitching Tests - NeoTeo
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www.neoteo.com 2026-09-26
2026-09-26
Intel Expects 14A Node to Be Within 5% of TSMC's A14 - TechPowerUp
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www.techpowerup.com 2026-09-26
2026-09-25
Government begins consultation to develop indigenous power semiconductor technology - tele.net.in
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tele.net.in 2026-09-25
2026-09-25
Taiwan Semiconductor Stock: AI Hiccups Lately, But Strong Growth Persists (NYSE:TSM) - Seeking Alpha
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seekingalpha.com 2026-09-25
2026-09-24
Intel Drops 3% as Profit Taking Follows 223% YTD Run; AMD Falls 3%, NVIDIA Slips - 24/7 Wall St.
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247wallst.com 2026-09-24
2026-09-24
ASML says it sold 'absolutely nothing' in Europe in 2026
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tomshardware.com 2026-09-24
ASML's zero revenue from Europe in 2026 marks a striking reversal for the company that once derived 5% of its sales from the region just two years prior. The core issue is not a lack of fab construction—Intel, ESMC, Infineon, and GlobalFoundries are all investing billions in European facilities—but
ASMLEUV LithographyEuropean SemiconductorLithography EquipmentChip ManufacturingMature NodeAdvanced NodeEU Chip Strategy
2026-09-24
ASML says it sold 'absolutely nothing' in Europe in 2026 — lithography giant calls on EU to help create demand - Tom's Hardware
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www.tomshardware.com 2026-09-24
2026-09-24
This Semiconductor Stock Could Be a Better Way to Invest in AI and Satellites Than SpaceX - finance.yahoo.com
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finance.yahoo.com 2026-09-24
2026-09-24
This Semiconductor Stock Could Be a Better Way to Invest in AI and Satellites Than SpaceX - The Motley Fool
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www.fool.com 2026-09-24
2026-09-24
Intel Malaysia expands advanced packaging capabilities in Penang for AI chips - Global Sources
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www.globalsources.com 2026-09-24
2026-09-24
Intel Malaysia expands advanced packaging capabilities in Penang for AI chips - Global Sources
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www.globalsources.com 2026-09-24
2026-09-24
India needs more fabs and advanced packaging units to meet semiconductor demand, says JM Financial report - tele.net.in
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tele.net.in 2026-09-24
2026-09-24
Intel Malaysia expands advanced packaging as AI chips grow more complex - Tech Wire Asia
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techwireasia.com 2026-09-24
2026-09-24
Toshiba Launches 3300V SiC MOSFET Module with High Surge Current Capability that Helps Improve Reliability of Industrial Equipment - Bluefield Daily Telegraph
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www.bdtonline.com 2026-09-24
2026-09-24
Not Intel. Not Nvidia. This Chip Giant Holds an Unbreakable Moat in Next-Gen Data Centers. - Yahoo Finance
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finance.yahoo.com 2026-09-24
2026-09-24
Not Intel. Not Nvidia. This Chip Giant Holds an Unbreakable Moat in Next-Gen Data Centers. - The Motley Fool
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www.fool.com 2026-09-24
2026-09-23
New Dutch innovation agency teams up with German counterpart on AI chip design challenge - Telecompaper
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www.telecompaper.com 2026-09-23
2026-09-23
Enabling Smarter and More Efficient AMRs with onsemi Intelligent Power and Sensing Solutions - eetasia.com
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news.google.com 2026-09-23
2026-09-23
Enabling Smarter and More Efficient AMRs with onsemi Intelligent Power and Sensing Solutions - eetindia.co.in
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news.google.com 2026-09-23