Semiconductor News & Analysis Feed
20 articles
2026-09-29
www.digitimes.com
2026-09-29
2026-09-29
www.digitimes.com
2026-09-29
This DIGITIMES feature, the second installment in a series dissecting CoWoS, examines how TSMC transformed what began as a niche packaging experiment into the de facto industry standard for high-performance AI accelerators. The central insight is that the AI era has fundamentally restructured the se
2026-09-28
www.thestandard.com.hk
2026-09-28
ESWIN Technology's bookbuilding for a Hong Kong IPO marks a notable milestone in the RISC-V ecosystem's commercialization trajectory. As the first RISC-V open-source chip designer to list on the HKEX, the company's offering of 1.57 billion H shares at HK$1.48–1.59 per share, raising up to HK$2.5 bil
2026-09-27
2026-09-22
www.marketscreener.com
2026-09-22
2026-09-22
www.tradingview.com
2026-09-22
2026-09-22
www.prnewswire.com
2026-09-22
2026-09-22
www.morningstar.com
2026-09-22
2026-09-22
www.prnewswire.com
2026-09-22
2026-09-15
www.mediatek.com
2026-09-15
2026-09-09
xenospectrum.com
2026-09-09
2026-09-08
www.techtimes.com
2026-09-08
2026-09-08
finance.biggo.com
2026-09-08
2026-08-24
developer.nvidia.com
2026-08-24
2026-08-24
blogs.nvidia.com
2026-08-24
2026-08-24
tomshardware.com
2026-08-24
Researchers at Kyoto University have developed a silicon carbide (SiC) transistor capable of operating at 600°C, using standard ion implantation techniques common in commercial chip fabrication. By employing a bottom-gate structure and double-well isolation, they significantly reduced the gap betwee
2026-08-18
www.hpcwire.com
2026-08-18
2026-08-14
simplywall.st
2026-08-14
SK Hynix, in collaboration with SanDisk, has unveiled a new High Bandwidth Flash (HBF) specification through the Open Compute Project, aimed at supporting AI inference workloads. This standard targets high-bandwidth, high-capacity near-compute memory, guiding AI hardware designers and encouraging ea
2026-08-14
news.google.com
2026-08-14
2026-08-13
sg.finance.yahoo.com
2026-08-13