Semiconductor News & Analysis Feed

16 articles
2026-06-10
www.thehindubusinessline.com 2026-06-10 BusinessLine
Engineering and technology company Bosch has launched the third-generation Silicon Carbide semiconductors, as per the company. These advanced chips control energy flow within the vehicle’s power electronics, specifically the inverter. This new generation delivers roughly 20 per cent higher performance, translating to a longer driving range without the need for larger batteries, improved battery u
2026-06-09
cxotoday.com 2026-06-09 CXOToday.com
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2026-06-09
www.bisinfotech.com 2026-06-09 Bisinfotech
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2026-06-09
ackodrive.com 2026-06-09 ACKO Drive
SiC semiconductors are central to inverter systems in electric vehicles, where they regulate the flow of electricity between the battery and the motor.  Bosch has introduced its third-generation silicon carbide (SiC) semiconductors in India, targeting the expanding electric vehicle (EV) market with a focus on improving efficiency and reducing energy losses in powertrain systems. The company said
2026-06-09
www.electronicsforyou.biz 2026-06-09 Electronics For You BUSINESS
HOME BUZZ BIZ TRENDS STARTUPS MANUFACTURING TRADE .GOV KEY SECTORS EXCLUSIVES Buzz Electric Vehicles Semicon Headlines Bosch Brings Third-Generation SiC Chips to India’s EV Market  By Nikita Kumari Share Bosch June 9, 2026 The new semiconductor platform promises higher efficiency, longer range, and more compact power electronics for next-generation electric vehicles.  Bosch has introduced its t
2026-06-09
auto.economictimes.indiatimes.com 2026-06-09 ET Auto
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2026-06-09
www.autocarpro.in 2026-06-09 Autocar Professional
Bosch Introduces Third-Generation SiC Chips for Electric Vehicle Applications in India New silicon carbide semiconductor generation is designed to improve EV powertrain efficiency, support longer driving range and enable more compact power electronics systems. By Eshisha Java 09 Jun 2026 105 Views Share - Bosch has introduced its third-generation silicon carbide (SiC) semiconductors in India,
2026-06-02
news.google.com 2026-06-02 EE Times Asia
2026-05-27
www.eqs-news.com 2026-05-27 EQS News
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2026-05-27
www.prnewswire.com 2026-05-27 PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 Deutschland - English VOM NACHRICHTENDIENST USI 27 Mai, 2026, 05:00 GMT ARTIKEL TEILEN ~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor pa
2026-05-27
www.thailand-business-news.com 2026-05-27 Thailand Business News
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2026-05-27
www.manilatimes.net 2026-05-27 The Manila Times
~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.prnewswire.com 2026-05-27 PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English NEWS PROVIDED BY USI 27 May, 2026, 07:00 CST SHARE THIS ARTICLE ~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
us.acrofan.com 2026-05-27 acrofan.com
~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-11
www.openpr.com 2026-05-11 openPR.com
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2026-05-07
www.openpr.com 2026-05-07 openPR.com
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