Semiconductor News & Analysis Feed
20 articles
2026-07-16
www.wardsauto.com
2026-07-16
2026-07-14
news.google.com
2026-07-14
2026-07-14
finance.biggo.com
2026-07-14
2026-07-11
news.google.com
2026-07-11
2026-06-10
www.thehindubusinessline.com
2026-06-10
Bosch has launched its third-generation silicon carbide (SiC) semiconductors to advance India's electric vehicle market. These chips control energy flow in vehicle power electronics, particularly the inverter, delivering 20% higher performance that translates to extended driving range, improved batt
2026-06-09
cxotoday.com
2026-06-09
Bosch's introduction of third-generation SiC chips represents a significant advancement for the EV industry, addressing the growing demand for high-performance power semiconductor solutions. SiC technology offers superior characteristics including high voltage tolerance, high frequency operation, an
2026-06-09
www.bisinfotech.com
2026-06-09
Bosch's introduction of third-generation SiC chips represents a significant advancement in electric vehicle technology, addressing key performance challenges in EV power management. SiC technology offers superior efficiency, higher power density, and enhanced thermal performance compared to traditio
2026-06-09
ackodrive.com
2026-06-09
Bosch has launched its third-generation silicon carbide (SiC) semiconductors in India to meet the growing demand for electric vehicles. These chips offer around 20% higher performance compared to previous generations, with improved thermal efficiency and reduced energy losses, enabling longer drivin
2026-06-09
www.electronicsforyou.biz
2026-06-09
Bosch has launched its third-generation Silicon Carbide (SiC) semiconductor technology in India, targeting the growing electric vehicle (EV) market. The new SiC chips aim to improve powertrain efficiency by reducing energy loss during conversion, thereby extending vehicle range and optimizing batter
2026-06-09
auto.economictimes.indiatimes.com
2026-06-09
Bosch's launch of third-generation SiC chips in India represents a significant advancement in automotive power semiconductor technology. This innovation addresses the growing demand for efficient power solutions in India's rapidly expanding electric vehicle market. SiC chips offer superior performan
2026-06-09
www.autocarpro.in
2026-06-09
Bosch has launched its third-generation silicon carbide (SiC) semiconductors in India, targeting the expanding electric vehicle (EV) market with technology designed to enhance powertrain efficiency and extend driving range. Compared to the previous generation, the new chips offer around 20% better p
2026-06-02
news.google.com
2026-06-02
2026-05-27
www.eqs-news.com
2026-05-27
On May 27, 2026, USI, a global leader in electronic design and manufacturing services, unveiled advanced silicon carbide (SiC) chip-embedded packaging technology at PCIM Europe 2026. The innovation integrates SiC dies into multilayer ABF substrates using Single-Side Copper Exposed (SSC) module packa
2026-05-27
www.prnewswire.com
2026-05-27
On May 27, 2026, USI, a global leader in electronic design and manufacturing services, unveiled breakthrough advancements in advanced power semiconductor packaging technology at PCIM Europe 2026. The company showcased its capability to embed silicon carbide (SiC) dies into multilayer ABF substrates
2026-05-27
www.thailand-business-news.com
2026-05-27
USI's advanced SiC chip-embedded packaging technology showcased at PCIM Europe 2026 represents a significant breakthrough in power semiconductor technology. SiC, as a third-generation semiconductor material, offers superior performance characteristics including high power density, efficiency, and th
2026-05-27
www.manilatimes.net
2026-05-27
On May 27, 2026, USI, a global leader in electronic design and manufacturing services, announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. The company successfully embedded silicon carbide (SiC) dies into multilayer ABF substrat
2026-05-27
www.prnewswire.com
2026-05-27
On May 27, 2026, USI, a global leader in electronic design and manufacturing services, unveiled breakthrough advancements in advanced power semiconductor packaging technology at PCIM Europe 2026. The company showcased its innovative approach of embedding silicon carbide (SiC) dies into multilayer AB
2026-05-27
us.acrofan.com
2026-05-27
USI, a global leader in electronic design and manufacturing services, has unveiled a breakthrough in advanced power semiconductor packaging technology at PCIM Europe 2026. The company successfully embedded silicon carbide (SiC) dies into multilayer ABF substrates and integrated ceramic substrate ins
2026-05-11
www.openpr.com
2026-05-11
2026-05-07
www.openpr.com
2026-05-07