Rohm SiC chips power BMW Neue Klasse EV architecture - Automotive World

Rohm Semiconductor has confirmed that its silicon carbide (SiC) chips are integrated into BMW’s Neue Klasse electric vehicle platform, underscoring the growing importance of SiC technology in high-end... Read original →

Rohm’s integration of SiC chips into BMW’s Neue Klasse platform marks a pivotal shift toward carbon silicon adoption in premium EV architectures. This move enhances power efficiency and charging performance, catalyzing upstream supply chain upgrades and intensifying competition among semiconductor players. From a compliance standpoint, the collaboration strengthens Rohm’s position in automotive electronics amid global supply chain realignment, though it heightens rivalry with industry leaders like Infineon and STMicroelectronics. In the short term, more automakers are likely to adopt SiC to gain performance advantages, while long-term trends indicate SiC becoming standard in EV powertrains, driving industry consolidation. With decarbonization goals accelerating, SiC’s application is expected to expand beyond automotive into rail and other high-power sectors.