Bosch introduces third generation SiC chips for EV growth and local ecosystem enablement - CXOToday.com

Bosch's introduction of third-generation SiC chips represents a significant advancement for the EV industry, addressing the growing demand for high-performance power semiconductor solutions. SiC techn... Read original →

Bosch’s third-gen SiC chips accelerate the automotive semiconductor stack’s shift from silicon to wide-bandgap materials. Upstream substrate and wafer suppliers now face tighter defect-density specs, while downstream e-drive architectures gain efficiency for 800V platforms. Amid EU and U.S. supply-chain localization mandates, Bosch reduces reliance on foundries in Taiwan, China, raising AEC-Q101 certification barriers and compliance costs for smaller Tier 1s. Infineon and STMicroelectronics will likely expedite 8-inch SiC ramp-ups and lock in OEM volume agreements. Over the next 18 months, module price wars may ease, but yield and material utilization will dictate competitiveness. Bosch isn’t just defending its e-mobility moat—it’s catalyzing Europe’s SiC ecosystem toward true supply autonomy.