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Intel has appointed Seok-Hee Lee as Executive Vice President of Intel Foundry, signaling a strategic push toward strengthening advanced packaging capabilities. Lee will report directly to CEO Lip-Bu Tan and lead areas including advanced packaging, system integration, and backend technology developme

Intel has appointed veteran semiconductor executive Seok-Hee Lee to lead its advanced packaging operations, underscoring the company’s renewed focus on rebuilding its manufacturing capabilities amid the AI-driven chip boom. This move follows a significant development when President Donald Trump anno

On June 19, 2026, Intel appointed veteran semiconductor executive Seok-Hee Lee as Executive Vice President of its Foundry division, overseeing advanced packaging, backend manufacturing, and system integration. Lee, who previously led SK On and SK Hynix, will report directly to CEO Lip-Bu Tan as Inte

Intel has appointed Seok-Hee Lee, former CEO of SK Hynix and SK On, as executive vice president of Intel Foundry, taking charge of advanced packaging, system integration, and backend technology development. This move reflects Intel's strategic shift to strengthen its position in advanced packaging,

Intel has appointed Seok-Hee Lee, former CEO of SK Hynix and SK On, as executive vice president of Intel Foundry, taking charge of advanced packaging, system integration, and backend technology development. This move marks a structural shift, with Intel splitting advanced packaging into a dedicated

Intel has appointed former SK Hynix CEO Seok-Hee Lee to lead its foundry packaging initiative, marking a strategic move to strengthen its position in advanced semiconductor manufacturing. Lee, who previously worked at Intel from 2000 to 2010, brings extensive experience in process integration and te

Intel's appointment of former SK Hynix CEO Seok-Hee Lee to lead its advanced packaging initiative represents a strategic move in the semiconductor industry's ongoing technology transformation. This personnel shift coincides with Intel's deepening partnership with Apple, highlighting the critical imp

On June 18, 2026, Intel appointed Seok-Hee Lee as Executive Vice President of Intel Foundry, tasked with leading the company's advanced packaging, system integration, and backend manufacturing operations. This move underscores Intel's strategic focus on packaging as a critical enabler for performanc

Intel has appointed veteran semiconductor executive Seok-Hee Lee as executive vice president of its contract chip-manufacturing division to lead advanced packaging, system integration, and back-end operations. This move underscores Intel's renewed focus on strengthening its manufacturing capabilitie