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2026-05-27
www.huaweicentral.com
2026-05-27
Huawei Central
HUAWEI
Mate 90 series chip will be close to 3nm process tech: Huawei
Published
16 minutes ago
on
May 27, 2026
By
Emiko Matsui
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Huawei has made another statement regarding the Mate 90 series chip tech, which may draw level with the 3nm process technology. The company stated this at the 2026 Phoenix Bay Area Finance Forum and Financial S
2026-05-27
www.tradingkey.com
2026-05-27
TradingKey
TSMC plans to increase 3nm process quotes by up to 15% in H2 2026 and 5-10% in 2027, driven by surging AI server demand from NVIDIA, Google, and AWS. Despite capacity expansion, shortages are expected to persist until 2027. This pricing power is becoming a strategic advantage in the AI era. TSMC's gross margin reached a record 66.2% in Q1 2026, with further increases anticipated. Foreign instituti
2026-05-27
www.aastocks.com
2026-05-27
AASTOCKS.com
Taiwan's Commercial Times, citing supply chain sources, reported that Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) will again raise quotations for its 3-nanometer process products in 2H, with increases of up to 15%, and may further lift prices by 5% to 10% next year.
It is understood that utilization at TSMC's main 3-nanometer facility, Fab 18, has remained at a high level. Altho
2026-05-27
www.aastocks.com
2026-05-27
AASTOCKS.com
Taiwan's Commercial Times, citing supply chain sources, reported that Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) will again raise quotations for its 3-nanometer process products in 2H, with increases of up to 15%, and may further lift prices by 5% to 10% next year.
It is understood that utilization at TSMC's main 3-nanometer facility, Fab 18, has remained at a high level. Altho
2026-05-27
digitimes.com
2026-05-27
Qualcomm has reached a deal to supply AI data center chips to ByteDance, giving the US smartphone processor designer a potentially high-volume customer as it tries to expand into AI infrastructure and custom silicon.
2026-05-27
digitimes.com
2026-05-27
Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying the showcase will demonstrate integrated capabilities in AI computing storage, high-speed transmission, and reliable data processing. The firm highlighted that as AI expands to endpoint applications, performance and s
2026-05-26
tomshardware.com
2026-05-26
Zhiye Liu
German media outlet PC Games Hardware benchmarks the Core 9 273PQE and compares it to modern mainstream processors.
2026-05-26
www.citybiz.co
2026-05-26
citybiz
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2026-05-26
news.google.com
2026-05-26
EE Times
2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
news.google.com
2026-05-26
EE Times Asia
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2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.
2026-05-26
digitimes.com
2026-05-26
Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV technologies to reduce energy consumption per wafer at the process level, while continuing to deepen its presence in Taiwan. The company also plans to hire around 1,000 new employees in Taiwan in 2026 to support custome
2026-05-26
digitimes.com
2026-05-26
For the past three years, graphics processing units, or GPUs, have dominated the artificial intelligence boom. But Johnny Shen, chairman of Alchip Technologies, believes the next phase of the market may belong to something more specialized.
2026-05-26
digitimes.com
2026-05-26
GlobalWafers held its shareholders' meeting on May 25, where CEO Doris Hsu stated that the semiconductor market in 2026 has gradually moved beyond 2025's two extremes, when only AI and advanced process technologies dominated growth. In 2026, non-AI and traditional application markets began to recover, making market conditions thrive.
2026-05-26
digitimes.com
2026-05-26
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.
2026-05-25
tomshardware.com
2026-05-25
Etiido Uko
Flagship Huawei Mate 90 series will be the first commercial processors to feature the LogicFolding architecture
2026-05-25
wccftech.com
2026-05-25
Wccftech
The U.S. sanctions may have closed Huawei’s trading capabilities with other countries to obtain access to the latest lithography and paraphernalia associated with mass producing next-generation chips, but what it also did was fuel the company’s desire to carve its mark without relying on overseas firms. Today, Huawei announced that by 2031, it will have chips with a manufacturing process equivalen
2026-05-25
wccftech.com
2026-05-25
Wccftech
AMD's next-gen Zen 7 "Grimlock" CPUs are rumored to utilize TSMC's 1.4nm (A14) process tech & new packaging innovations.
The Zen 6 architecture is yet to make a formal entry into mainstream server and consumer segments, and while mass production has already begun on TSMC's 2nm process tech, the company is now prepping its supply chain partners for the next-generation lineup.
In a report by Taiwa