Exclusive Interview: Dutch startup Nearfield bets on process control to rival EUV in AI chip manufacturing

Dutch startup Nearfield’s bet on advanced process control represents a paradigm shift beyond Moore’s Law, targeting the physical and geopolitical constraints of EUV lithography. This move pressures metrology and inspection suppliers to deliver sub-nanometer closed-loop systems and forces deposition/etch tools toward unprecedented uniformity. While sidestepping some export controls from the U.S.-led coalition, this alternative path demands full fab requalification—raising operational risk and capital intensity. ASML will likely double down on High-NA EUV ecosystem lock-in, while Applied Materials and Lam Research may accelerate integration of in-situ process control to hedge against route fragmentation. If Nearfield demonstrates yield parity below 3nm within 18 months, second-tier foundries could reassess 'EUV-free' lines, eroding ASML’s near-monopoly in leading-edge manufacturing.