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20 articles
Trending Companies
Nvidia58 NVIDIA16 Intel13 Foxconn7 Nscale5 Anthropic5 Google5 Qualcomm4 Samsung3 Microsoft3 SK Hynix3 SK Group3
Trending Technologies
AI12 AI data center5 AI infrastructure3 Edge AI3 Agentic AI3 2nm3 GPU3 advanced packaging3 HBM3 Vera Rubin2 memory2 RAM2
2026-10-30
Samsung secures Faraday 2nm ASIC order, broadening AI and HPC footprint
0.95
digitimes.com 2026-10-30
2026-10-30
Infineon’s OktoberTech: Edge AI, SDVs, and the Road to 800 VDC
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eetimes.com 2026-10-30
2026-10-28
SK Hynix hits record revenue as AI memory boom drives DRAM prices higher - Proactive financial news
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www.proactiveinvestors.com 2026-10-28
2026-10-28
Anthropic's surging compute demand fuels ASIC prospects, favoring Broadcom over MediaTek
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digitimes.com 2026-10-28
2026-10-27
Broadcom, financial firms agree on US$63 billion funding for Anthropic chip purchases
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digitimes.com 2026-10-27
2026-10-26
Large-Format Masks Move From Aspiration To Industry Roadmap
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semiengineering.com 2026-10-26
2026-10-21
NVIDIA unveils modular AI factories to cut data centre deployment to 14 days - Proactive financial news
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www.proactiveinvestors.com 2026-10-21
2026-10-21
Nvidia's Vera CPU signals a broader shift in AI infrastructure
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digitimes.com 2026-10-21
2026-10-21
Apple Expands $600 Billion U.S. Manufacturing Plan With Qnity, Perryman, Broadcom, Corning, Coherent, TSMC, And Amkor - Pulse 2.0
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pulse2.com 2026-10-21
2026-10-20
Alibaba unveils automotive RISC-V processor IP and roadmap for self-driving and robotics - TechNode
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technode.com 2026-10-20
2026-10-19
The road not taken Part 2 of 2: TSMC's first CTO said no to Intel twice but still wonders what if
0.8
digitimes.com 2026-10-19
2026-10-19
The road to TSMC Part 1 of 2: the DARPA challenge behind TSMC's success
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digitimes.com 2026-10-19
2026-10-16
Infineon at electronica 2026: Technology for the AI era, from data centres into robots and onto the road - ELE Times
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www.eletimes.ai 2026-10-16
2026-10-15
Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
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digitimes.com 2026-10-15
2026-10-14
Broadcom, Marvell and TSMC cash in as Big Tech builds custom AI chips - Crypto Briefing
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cryptobriefing.com 2026-10-14
2026-10-14
Broadcom executive says chipmakers must tackle packaging, power limits together
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digitimes.com 2026-10-14
2026-10-14
Amazon's Decart talks point to a broader push from custom silicon to world models
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digitimes.com 2026-10-14
2026-10-13
Broadcom, Intel CEOs warn capital could become AI's biggest bottleneck
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digitimes.com 2026-10-13
2026-10-12
AI racks approach megawatt power levels as SiC, GaN, silicon divide power delivery roles
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digitimes.com 2026-10-12
2026-10-12
India roundup: AI data center buildout accelerates as semiconductor push continues to broaden
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digitimes.com 2026-10-12