Semiconductor News & Analysis Feed
2424 articles
2026-05-27
digitimes.com
2026-05-27
Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying the showcase will demonstrate integrated capabilities in AI computing storage, high-speed transmission, and reliable data processing. The firm highlighted that as AI expands to endpoint applications, performance and s
2026-05-27
digitimes.com
2026-05-27
Kinpo Electronics outlined its 2026 core strategy at a shareholders' meeting on May 25, centering on "bearing fruit" as it builds on years of product-mix adjustments, expands into AI-related products, and accelerates its shift toward an ODM model.
2026-05-27
digitimes.com
2026-05-27
SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for short-reach AI cluster links. The collaboration could accelerate the commercialization of Micro LED co-packaged optics (CPO) technology and strengthen China's role in global AI infrastructure supply chains, according to
2026-05-27
insurancenewsnet.com
2026-05-27
InsuranceNewsNet
insurancenewsnet.com
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2026-05-27
aijourn.com
2026-05-27
The AI Journal
BILLERICA, Mass. & TOKYO–(BUSINESS WIRE)–Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, today announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet
2026-05-27
news.google.com
2026-05-27
Business Wire
2026-05-27
www.upi.com
2026-05-27
upi.com
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2026-05-27
seekingalpha.com
2026-05-27
Seeking Alpha
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2026-05-27
aws.amazon.com
2026-05-27
Amazon Web Services (AWS)
Build high-performance generative AI systems with Strands Agents, NVIDIA NIM, and Amazon Bedrock AgentCore
by Kanishk Mahajan and Akshay Parkhi on 26 MAY 2026 in Amazon Bedrock Agents, Best Practices, Strands Agents, Technical How-to, Thought Leadership Permalink Comments Share
Building high-performance generative AI agents requires architecture that can deliver fast inference, coordinate multi
2026-05-27
www.01net.it
2026-05-27
01net
www.01net.it
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2026-05-26
www.chosun.com
2026-05-26
조선일보
By Seongmin K
Published 2026.05.27. 00:34
Concept diagram of SK Hynix's iHBM technology. ICE, a thermal control element, serves as a passage for heat dissipation. /SK Hynix
SK Hynix unveiled on the 26th its "iHBM" technology, which significantly reduces heat generation in high-bandwidth memory (HBM) used in AI accelerators.
As demand for AI computations rises, the workload of HBM mounted on AI
2026-05-26
www.tradingkey.com
2026-05-26
TradingKey
Optical communication stocks surged on May 26 due to advancements in GPU-HBM integration using fiber optic interconnects. This innovative solution overcomes physical limitations of traditional 2.5D packaging by decoupling compute and memory units, allowing greater HBM capacity and improved thermal management. If successful, it will expand optical interconnects beyond data centers and benefit silic
2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
www.mlex.com
2026-05-26
MLex
( May 26, 2026, 12:59 GMT | Official Statement) -- MLex Summary: Texas Instruments and Silicon Laboratories' received merger clearance when the Hart-Scott-Rodino waiting period expired just before midnight EST on May 22, 2026, according to a Silicon Laboratories filing with the US Securities and Exchange Commission. Excerpt. . . .
2026-05-26
www.minichart.com.sg
2026-05-26
Minichart
www.minichart.com.sg
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2026-05-26
www.insidermonkey.com
2026-05-26
Insider Monkey
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2026-05-26
uk.finance.yahoo.com
2026-05-26
Yahoo Finance UK
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2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
www.tomshardware.com
2026-05-26
Tom's Hardware
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2026-05-26
www.marketscreener.com
2026-05-26
marketscreener.com
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