SemiPulse | AI-Powered Semiconductor Supply Chain Intelligence & Market Signals

TSMC, ASML, and Imec target 2D chip mass production in Taiwan within five years

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digitimes.com 2026-07-10

ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor materials, marking a significant step toward commercializing technologies widely viewed as essential for extending Moore's Law beyond the limits of conventional silicon scaling.

TSMC CoWoS output reportedly to reach at least 200K wafers in 2027

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digitimes.com 2026-07-10

TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.

PCB midplane snags cast doubt on Nvidia's Kyber rack timeline

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digitimes.com 2026-07-10

Nvidia has denied reports that its next-generation Kyber AI rack system could be delayed to 2028, saying its product roadmap remains unchanged, after SemiAnalysispointed to manufacturing challenges in a key PCB midplane as a potential bottleneck for the Rubin Ultra platform.

GlobalWafers-Micron deal pushes US semiconductor localization beyond chip fabs

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digitimes.com 2026-07-10

GlobalWafers and Micron have signed a 10-year supply agreement, alongside US$500 million in strategic financial support, in a move that underscores how artificial intelligence (AI), high-performance computing (HPC), data centers, and advanced memory demand are reshaping semiconductor sourcing. The deal extends US supply chain localization beyond wafer production and into upstream critical material

LG Innotek expands Vietnam footprint with new IC substrate plant

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digitimes.com 2026-07-10

LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to expand capacity for advanced packaging products used in AI servers and high-end mobile devices.

Former chip designer turned VC delivers reality check on AI, CPO hype

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digitimes.com 2026-07-10

A veteran chip engineer turned venture capitalist used a panel at Taipei's Asia VC Summit on Wednesday to challenge two of the semiconductor industry's most fashionable narratives: that AI will solve chip design, and that co-packaged optics (CPO) is ready for prime time.

Meta readies Iris chip, locks in supply for push to 14 gigawatts

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digitimes.com 2026-07-10

Meta Platforms plans to begin manufacturing its Iris AI accelerator in September 2026 while securing long-term supplies of memory, storage and optical equipment for a computing expansion expected to reach 14 gigawatts in 2027.

E&R Engineering advances glass substrate pilot production to 2H27

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digitimes.com 2026-07-10

E&R Engineering says AI demand and faster-than-expected glass substrate adoption are tightening equipment supply and advancing investment plans across Asia and the US. For global chip makers, the shift could accelerate next-generation packaging capacity, reshape supplier spending, and bring advanced process tools into volume production sooner than expected.

China's AI talent demand spreads into chips, rare earths, and new materials

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digitimes.com 2026-07-10

China's graduate job market is shifting toward semiconductors, materials, and manufacturing, with global implications for supply chains, AI development, and critical minerals. Fresh salary data show computer science and software engineering losing ground as strategic industries draw more talent, while hard tech majors gain pay advantages across the country.

CSP ASIC demand drives structural growth in high-speed interconnects

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digitimes.com 2026-07-10

As cloud service providers (CSPs) continue to ramp up capital expenditures, demand for high-speed interconnects within data centers is accelerating. Multiple research firms forecast that leading CSPs will sustain high double-digit capex growth in 2026, with roughly half of the increase driven by data center expansion.

Nvidia's Jensen Huang to revisit Sega roots in Japan as AI PC competition intensifies

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digitimes.com 2026-07-10

Nvidia CEO Jensen Huang will travel to Japan for an event celebrating the US chipmaker's three-decade relationship with Sega, revisiting a partnership that helped Nvidia survive its difficult early years as semiconductor competition expands from data centers to personal computers.

Did Cadence’s HPE Digital Twin Data Center Push Just Shift Cadence Design Systems' (CDNS) Investment Narrative? - simplywall.st

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simplywall.st 2026-07-10 simplywall.st

Micron celebrates being ahead of schedule - Oswego County News Now

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www.oswegocountynewsnow.com 2026-07-10 Oswego County News Now

Micron ceremonial concrete pour filled with celebration of American manufacturing - Central Current

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centralcurrent.org 2026-07-10 Central Current

Entegris, onsemi, and Power Integrations Shares Are Soaring, What You Need To Know - Yahoo Finance

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finance.yahoo.com 2026-07-10 Yahoo Finance