Semiconductor News & Analysis Feed

162 articles
2026-05-12
pressreleasehub.pa.media 2026-05-12 PA Media
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2026-05-12
www.morningstar.com 2026-05-12 Morningstar
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2026-05-12
news.google.com 2026-05-12 Business Wire
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2026-05-12
restofworld.org 2026-05-12 Rest of World
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2026-05-12
www.fool.com 2026-05-12 The Motley Fool
WhenIntel(INTC+3.56%)was added to theDow Jones Industrial Average(^DJI+0.19%)in November 1999, it was a sign of the tech industry's rising importance to the U.S. stock market -- Intel and another new addition,Microsoft, were the first two stocks from the tech-heavy Nasdaq exchange to join the DJIA.When Intel was replaced in the Dow byNvidia(NVDA+1.90%)in November 2024, the chipmaker had lost not o
2026-05-11
www.marketbeat.com 2026-05-11 MarketBeat
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2026-05-10
pulse2.com 2026-05-10 Pulse 2.0
Qualcomm Technologies has announced two new mobile platforms — the Snapdragon 6 Gen 5 and Snapdragon 4 Gen 5 — expanding its portfolio with next-generation capabilities designed for real-world smartphone experiences. Both platforms are set to power commercial devices from global OEMs, including Honor, OPPO, realme, and REDMI, in the second half of 2026.The centerpiece feature across both new platf
2026-05-08
www.moomoo.com 2026-05-08 Moomoo
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2026-05-07
koreajoongangdaily.joins.com 2026-05-07 Korea JoongAng Daily
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2026-05-07
news.google.com 2026-05-07 Android Central
2026-05-07
news.google.com 2026-05-07 9to5Google
2026-05-07
www.panewslab.com 2026-05-07 PANews
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2026-05-07
semiengineering.com 2026-05-07 Ann Mutschler
The semiconductor ecosystem is wrestling with fragmented standards, IP exposure, and th...
2026-05-05
www.blocksandfiles.com 2026-05-05 Blocks & Files
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2026-05-05
hothardware.com 2026-05-05 HotHardware
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2026-05-05
www.msn.com 2026-05-05 MSN
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2026-05-05
seekingalpha.com 2026-05-05 Seeking Alpha
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2026-05-05
www.tipranks.com 2026-05-05 TipRanks
2026-04-01
eetimes.com 2026-04-01 Pablo Valerio
Alibaba is directly challenging global chip leaders by leveraging open-standard architecture to redefine the AI hardware landscape.
digitimes.com
Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status se