Semiconductor News & Analysis Feed
412 articles
2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
www.thefastmode.com
2026-05-26
The Fast Mode
Stellantis and Qualcomm Technologies announced an expansion of their multi-year technology collaboration to power next-generation Stellantis vehicles with Qualcomm Technologies’ Snapdragon® Digital Chassis™ system-on-chips (SoCs).
The expanded collaboration integrates Snapdragon Digital Chassis solutions with STLA Brain, Stellantis’ electronic and software platform, enhancing cockpit, connectivit
2026-05-26
www.ad-hoc-news.de
2026-05-26
AD HOC NEWS
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2026-05-26
digitimes.com
2026-05-26
Taiwan-based AI server maker Wiwynn is accelerating its global expansion as surging demand for AI infrastructure creates mounting pressure on power supply, production capacity, and critical component availability.
2026-05-26
digitimes.com
2026-05-26
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutt
2026-05-26
digitimes.com
2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks and tighter supply expected through 2027. The developments could reshape supply chains for servers, data centers, and high-power consumer electronics worldwide, and accelerate global investment in components.
2026-05-26
digitimes.com
2026-05-26
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter to unveil its latest laser product, Guide DR. To advance its 3D-stacked silicon photonics engine, Lightmatter is also working closely with TSMC using its Compact Universal Photonic Engine (COUPE) platform.
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.
2026-05-26
digitimes.com
2026-05-26
Following GlobalWafers' shareholders' meeting on May 25, Chairperson Doris Hsu stated that the company's core compound semiconductor business, gallium nitride (GaN), is addressing strong demand for high-efficiency power solutions in AI servers. The company is also beginning to see emerging demand from diversified applications such as AI robotics. As a result, production capacity in 2026 has alread
2026-05-25
tomshardware.com
2026-05-25
Dan Mateescu
Here's one way of solving Nvidia's melting power connectors.
2026-05-25
eetimes.com
2026-05-25
The power and thermal issues of placing data centers in space are formidable.
2026-05-25
themachinemaker.com
2026-05-25
Machine Maker
themachinemaker.com
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2026-05-25
www.eenewseurope.com
2026-05-25
eeNews Europe
Infineon Technologies has kicked off a major European R&D initiative aimed at developing the next generation of sustainable power electronics for applications ranging from renewable energy systems to electric vehicles and rail transport.
The three-year Moore4Power project brings together 62 partners from 15 countries under the EU Chips Joint Undertaking program, with a total budget of €91 million
2026-05-25
news.google.com
2026-05-25
EE Times Asia
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2026-05-25
digitimes.com
2026-05-25
Nvidia's decision to sell its Vera CPU as a standalone chip could create a new source of demand for low-power DRAM, adding another pressure point to the already tight memory supply chain.
2026-05-25
digitimes.com
2026-05-25
Anthropic has reportedly approached Microsoft about renting AI computing power running on Microsoft's in-house chips to expand support for its Claude model business. The move is a positive sign for Microsoft and could generate momentum for the mass production of its recently unveiled Maia 200 chip, while ASIC players such as Global Unichip and Ethernet chip suppliers Marvell Technology and Broadco
2026-05-25
digitimes.com
2026-05-25
The shift toward 800V high-voltage direct current (HVDC) power architectures in AI data centers is driving a surge in demand for power semiconductors, boosting shipments for Taiwanese lead frame suppliers SDI Corporation and Jih Lin Technology and raising expectations for double-digit revenue growth in 2026.
2026-05-25
digitimes.com
2026-05-25
Cyient Semiconductors has secured a total of about US$30 million in financing from Edelweiss-managed funds and co-investors, comprising a US$10 million equity investment at a valuation of roughly US$500 million alongside structured debt. The deal bolsters its capital base to scale its power semiconductor and custom silicon offerings for global AI markets.