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Huawei Tau Law series 1: How China's chip industry is pivoting beyond Moore's Law

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digitimes.com 2026-05-26

When Huawei unveiled its "Tau (τ) Scaling Law" at ISCAS 2026 in Shanghai, the announcement signalled more than another chip architecture update. It marked China's most ambitious attempt yet to redefine how semiconductor performance is measured in the post-Moore era.

LED maker Ennostar pivots to optical interconnects after high-value shift agin traction

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digitimes.com 2026-05-26

Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account for more than half of revenue. Despite continued uncertainty in the global environment, Peng remains cautiously optimistic about the second half of 2026 and expects the company to maintain relatively strong performa

SK hynix unveils 'iHBM' thermal solution to boost AI performance - PR Newswire

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www.prnewswire.com 2026-05-26 PR Newswire

SK hynix unveils 'iHBM' thermal solution to boost AI performance NEWS PROVIDED BY SK hynix Inc. May 25, 2026, 19:39 ET SHARE THIS ARTICLE Enhances heat dissipation by integrating ICEs into the HBM package Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments Lowers barriers to adoption by leveraging market-proven MR–

Semiconductor Memory Chips HBM AI Computing Thermal Management Packaging Technology SK Hynix Chip Cooling

SK hynix unveils 'iHBM' thermal solution to boost AI performance – Company Announcement - Financial Times

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markets.ft.com 2026-05-26 Financial Times

SEOUL, South Korea , May 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products. [1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-

SK hynix HBM memory AI chips thermal management semiconductor packaging memory technology GPU accelerator chip cooling

SK hynix unveils 'iHBM' thermal solution to boost AI performance - Yahoo Finance Singapore

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sg.finance.yahoo.com 2026-05-26 Yahoo Finance Singapore

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Huawei reveals post-Moore semiconductor roadmap targeting 1.4nm-equivalent chip performance - digitimes

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www.digitimes.com 2026-05-25 digitimes

HiSilicon president and Huawei Technologies director He Tingbo. Credit: Xinhua As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and system-level optimisation rather than pure transistor... Some subscribers prefer to save their log-in information

Semiconductor Industry Huawei Moore's Law Chip Performance Post-Moore Era Chip Manufacturing Technology Roadmap Chip Architecture

Huawei has proposed a new principle for semiconductor advancement, aiming to achieve 1.4-nanometer equivalent performance by 2031. - 富途牛牛

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news.futunn.com 2026-05-25 富途牛牛

① The Tao (τ) Law proposes replacing “geometric scaling” with “time (τ) scaling” as the new guiding principle for the evolution of semiconductors and electronic systems. ② Based on the Tao (τ) Law, Huawei has already designed and mass-produced 381 chip models. The Kirin chip, set to debut in the fall of 2026, will be the first to adopt Logic Folding technology. According to a report by The Scienc

Semiconductor Development Principle Huawei Tao's Law Logic Folding Technology Time Scaling Chip Design Computational Performance Chip Manufacturing AI Chip

HUAWEI Presents the Tau (τ) Scaling Law, Enabling Breakthroughs in Transistor Density and System Performance - Huawei

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www.huawei.com 2026-05-25 Huawei

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Huawei reveals post-Moore semiconductor roadmap targeting 1.4nm-equivalent chip performance

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digitimes.com 2026-05-25

As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and system-level optimisation rather than pure transistor miniaturisation.

SK hynix's (KRX:000660) Performance Raises Some Questions - simplywall.st

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simplywall.st 2026-05-24 simplywall.st

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Nvidia Stock Underperformance 'One Of The Mysteries Of The Universe,' Says CEO Jensen Huang — Wall Street Analysts Agree It Shouldn't Be - Stocktwits

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stocktwits.com 2026-05-22 Stocktwits

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Unlock Exascale Performance on NVIDIA GB200 NVL72 with Slurm Topology-Aware Job Scheduling - NVIDIA Developer

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developer.nvidia.com 2026-05-22 NVIDIA Developer

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