Semiconductor News & Analysis Feed
20 articles
2026-07-31
xenospectrum.com
2026-07-31
Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly developing an advanced packaging technology similar to Intel's Embedded Multi-die Interconnect Bridge (EMIB), according to The Information, which cited two sources familiar with the project. The collaboration involves substrate maker Ki
2026-07-28
news.google.com
2026-07-28
2026-07-28
news.google.com
2026-07-28
2026-07-27
news.google.com
2026-07-27
2026-07-27
news.google.com
2026-07-27
2026-07-15
finance.yahoo.com
2026-07-15
2026-07-09
theedgemalaysia.com
2026-07-09
Malaysia's Science, Technology and Innovation Minister Datuk Chang Lih Kang announced on July 9 that the government aims to commercialize advanced packaging technology developed through research and development projects under the Malaysian Science Endowment (MSE) after a two-year capacity-building p
2026-07-06
news.futunn.com
2026-07-06
2026-06-24
www.marketscreener.com
2026-06-24
GlobalFoundries has successfully validated its SLATE advanced packaging technology on the 9SW platform, marking a significant advancement for next-generation RF applications. This validation demonstrates GlobalFoundries' technical capabilities in advanced packaging and strengthens its competitive po
2026-06-23
www.manilatimes.net
2026-06-23
GlobalFoundries has announced that its SLATE™ wafer-to-wafer bonding technology is now production-ready on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, enabling compact and high-performance front-end modules (FEMs) for next-generation 5G devices. Manufactured at i
2026-06-23
gf.com
2026-06-23
GlobalFoundries announces advanced packaging technology adoption on its 9SW platform for next-generation radio frequency applications, marking a significant advancement in semiconductor manufacturing. The 9SW platform's integration of advanced packaging techniques enables substantial performance and
2026-06-16
www.tradingkey.com
2026-06-16
TSMC has partnered with Ibiden and Innolux to advance glass substrate technology for its next-generation CoPoS (Chip-on-Panel-on-Substrate) advanced packaging. This shift from wafer-level to panel-level processing addresses limitations of traditional organic and silicon interposers, particularly in
2026-06-11
news.futunn.com
2026-06-11
2026-06-02
news.google.com
2026-06-02
2026-05-27
www.eqs-news.com
2026-05-27
On May 27, 2026, USI, a global leader in electronic design and manufacturing services, unveiled advanced silicon carbide (SiC) chip-embedded packaging technology at PCIM Europe 2026. The innovation integrates SiC dies into multilayer ABF substrates using Single-Side Copper Exposed (SSC) module packa
2026-05-27
www.prnewswire.com
2026-05-27
On May 27, 2026, USI, a global leader in electronic design and manufacturing services, unveiled breakthrough advancements in advanced power semiconductor packaging technology at PCIM Europe 2026. The company showcased its capability to embed silicon carbide (SiC) dies into multilayer ABF substrates
2026-05-27
www.thailand-business-news.com
2026-05-27
USI's advanced SiC chip-embedded packaging technology showcased at PCIM Europe 2026 represents a significant breakthrough in power semiconductor technology. SiC, as a third-generation semiconductor material, offers superior performance characteristics including high power density, efficiency, and th
2026-05-27
www.manilatimes.net
2026-05-27
On May 27, 2026, USI, a global leader in electronic design and manufacturing services, announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. The company successfully embedded silicon carbide (SiC) dies into multilayer ABF substrat
2026-05-27
www.prnewswire.com
2026-05-27
On May 27, 2026, USI, a global leader in electronic design and manufacturing services, unveiled breakthrough advancements in advanced power semiconductor packaging technology at PCIM Europe 2026. The company showcased its innovative approach of embedding silicon carbide (SiC) dies into multilayer AB
2026-05-27
us.acrofan.com
2026-05-27
USI, a global leader in electronic design and manufacturing services, has unveiled a breakthrough in advanced power semiconductor packaging technology at PCIM Europe 2026. The company successfully embedded silicon carbide (SiC) dies into multilayer ABF substrates and integrated ceramic substrate ins