Semiconductor News & Analysis Feed
24 articles
2026-07-22
digitimes.com
2026-07-22
HKC, the world's third-largest LCD panel supplier, plans to invest CNY4 billion (approx. US$590 million) in a 12-inch chip packaging and testing project, joining BOE and other Chinese display makers in expanding upstream into semiconductors.
2026-07-16
digitimes.com
2026-07-16
As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China. ASE, SPIL, KYEC, Greatek, and Tong Hsing are all pushing ahead in 2026 to strengthen supply-chain resilience amid geopolitical risk.
2026-07-15
digitimes.com
2026-07-15
China's JCET expects stronger first-half earnings as global demand tied to artificial intelligence (AI) infrastructure lifts semiconductor activity. The outlook signals continued momentum in chip packaging and testing, a sector closely watched by investors because it reflects broader technology spending trends that affect supply chains across Asia, the US, and Europe.
2026-07-15
digitimes.com
2026-07-15
Taiwan's back-end packaging and testing (OSAT) industry posted US$3,105.4 million in June 2026 revenue, up 2.9% month-over-month and 23.7% year-over-year — a solid, steady pace, but one that masks sharply divergent performance beneath the surface.
2026-07-14
digitimes.com
2026-07-14
China's semiconductor packaging and testing firm Tianshui Huatian Technology said on July 14 it expects first-half 2026 net profit attributable to shareholders of CNY750 million (approx. US$110.62 million) to CNY850 million, up 231.16% to 275.31% from CNY226 million a year earlier, according to a forecast filed with the Shenzhen Stock Exchange. Diluted earnings per share are seen at CNY0.2290-0.25
2026-07-14
digitimes.com
2026-07-14
Integrated Service Technology Inc. (iST) reported June 2026 consolidated revenue of about NT$426 million (US$13.24 million), up 10.47% from May and down 1.56% year on year. The Taiwan-based chip validation and analysis provider said the result reflected stronger demand tied to AI chip validation and a spillover effect from capacity constraints at packaging and testing plants.
2026-07-13
digitimes.com
2026-07-13
King Yuan Electronics (KYEC) approved a US plant investment of up to US$1.4 billion, or about NT$44.9 billion, on July 10 as the US continued pushing to expand domestic chip manufacturing. The semiconductor testing company said the project would be its largest overseas expansion and was aimed at addressing a growing US gap in backend packaging and testing capacity.
2026-07-10
digitimes.com
2026-07-10
ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and testing, conventional backend services and AI-related applications. June revenue reached its second-highest monthly level on record, while quarterly growth exceeded the company's previous guidance.
2026-07-07
digitimes.com
2026-07-07
Huawei's next-generation flagship Mate 90 smartphone series has reportedly entered the chip packaging and testing stage, according to sources within China's supply chain. The lineup is expected to launch in September 2026 and will be the first to feature Huawei's new Kirin 2026 flagship processor, which is based on the company's Tau Scaling (τ) concept. The device is expected to be one of Huawei's
2026-07-06
digitimes.com
2026-07-06
Greatek Electronics, a subsidiary of memory packaging and testing provider Powertech Technology (PTI), has approved the acquisition of On Semiconductor SSMP Philippines, a packaging and testing services company under the On Semiconductor (Onsemi) group, using internal funds. The acquisition aims to strengthen the group's overseas operational footprint and improve its global customer service capabi
2026-07-06
digitimes.com
2026-07-06
LG Chem has begun supplying semiconductor strippers to Amkor Technology, a major US-based packaging and testing provider, in its first commercial move into the market. The deal highlights rising demand for advanced chip-making chemicals as artificial intelligence, high-bandwidth memory, and smaller device designs reshape global semiconductor manufacturing.
2026-07-01
digitimes.com
2026-07-01
Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since late 2025, outsourced semiconductor assembly and test, or OSAT, capacity has tightened steadily. New capacity added in 2026 has also been filled quickly, prompting multiple IC design houses to lock in capacity and pus
2026-06-29
digitimes.com
2026-06-29
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment of a former TSMC executive as an independent director by Chairman Chiang Shang-yi has also drawn industry attention to the commercialization progress of its high-speed optical transceiver business.
2026-06-27
digitimes.com
2026-06-27
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
2026-06-27
digitimes.com
2026-06-27
ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging, testing, and optoelectronic integration capabilities under Foxconn's "3+3+3" strategy to seize advanced packaging opportunities in AI optical communications.
2026-06-25
digitimes.com
2026-06-25
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.
2026-06-25
digitimes.com
2026-06-25
IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan, Europe, and the US say the shortage is worse than expected, pushing packaging, testing, and related materials into broader supply constraints.
2026-06-25
digitimes.com
2026-06-25
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to divers
2026-06-23
digitimes.com
2026-06-23
Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of 24 tracked companies posting positive year-over-year gains, according to monthly revenue filings compiled for the period. The results underscore continued downstream demand driven by AI-related chip shipments and a broader recovery in consumer electronics.
2026-06-12
digitimes.com
2026-06-12
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers and supply chains, the shift suggests stronger demand for Taiwan's packaging and testing firms, alongside a broader rebalancing of semiconductor production.