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Cadence has launched its new AuraStack AI Super Agent, tailored for PCB and advanced packaging design. Built on an AI-native platform, it streamlines the entire design cycle from system planning to final product realization. Powered by NVIDIA Blackwell and CUDA-X, the platform coordinates domain-spe

Cadence introduces AuraStack AI Super Agent, the world’s first agentic AI platform tailored for PCB and advanced packaging design, integrated into Allegro AI Studio. This AI-native solution leverages NVIDIA Blackwell and CUDA-X acceleration to orchestrate multiple domain-specific agents across plann