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Shinko Electric acquires JDI's Mobara Fab to expand AI packaging capacity

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digitimes.com 2026-10-01

Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM - digitimes

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www.digitimes.com 2026-09-15

Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM - digitimes

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www.digitimes.com 2026-09-15

Samsung Electronics is accelerating semiconductor packaging restructuring by reallocating capacity from Exynos to HBM products at its Cheonan facility. This strategic reallocation reflects Samsung's response to evolving market dynamics and competitive pressures in the semiconductor industry. HBM mem

Samsung Electronics Semiconductor Packaging Exynos Processor HBM Memory Chip Manufacturing Capacity Reallocation Semiconductor Industry Memory Chip

ASE August revenue tops NT$80 billion record as AI packaging capacity stays sold out

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digitimes.com 2026-09-10

TSMC's CoWoS Packaging Capacity Grew 9x in Three Years, Yet AI Chip Shortage Remains - XenoSpectrum

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xenospectrum.com 2026-08-31

NVIDIA's Feynman Architecture Launch Pulled Forward; TSMC's A16 Process and Advanced Packaging Capacity in Full Preparation Mode - finance.biggo.com

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news.google.com 2026-08-14

TSMC Doubles Advanced Packaging Capacity Over Three Years, Samsung Goes All-In on 2nm Mass Production - finance.biggo.com

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finance.biggo.com 2026-08-14

As artificial intelligence semiconductor demand surges, TSMC—the world's largest foundry—has revealed it has doubled its advanced packaging capacity annually over the past three years. Despite this expansion, the company cannot fully meet customer demand, highlighting the robust growth in AI chip ma

Semiconductor Manufacturing TSMC Samsung Electronics Advanced Packaging AI Semiconductors 2nm Process Foundry Services Semiconductor Supply Chain

AI strains mature-node and packaging capacity, leaving chip designers with orders but no supply

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digitimes.com 2026-07-31

ASE sees full-year LEAP revenue topping US$3.5 billion amid tight packaging capacity

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digitimes.com 2026-07-30

[Insight] NVIDIA and Broadcom Begin Volume Ramp of CPO Switches, with Optical Engine Yield and Advanced Packaging Capacity Emerging as Key Expansion Bottlenecks, Says TrendForce - LEDinside

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www.ledinside.com 2026-07-29

Amkor and NVIDIA expand advanced packaging capacity - Engineering.com

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news.google.com 2026-07-28

NVIDIA and Broadcom Begin Volume Ramp of CPO Switches, with Optical Engine Yield and Advanced Packaging Capacity Emerging as Key Expansion Bottlenecks, Says TrendForce - TrendForce

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news.google.com 2026-07-27

Amkor inks $1.5B deal with Nvidia to expand Arizona chip packaging capacity - The Business Journals

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www.bizjournals.com 2026-07-24

TSMC Expands Advanced Packaging Capacity in Southern Taiwan to Help Meet AI Demand - marketscreener.com

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news.google.com 2026-07-13

Samsung develops glass interposer as TSMC expands packaging capacity

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digitimes.com 2026-07-13

IC design firms race to secure packaging capacity

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digitimes.com 2026-06-25

Global IC design companies are accelerating partner network expansion to address severe packaging and testing capacity shortages that have become the most critical supply chain bottleneck. Companies from Taiwan, Europe, and the US report that current capacity shortages are worse than expected, becom

IC design Packaging capacity Supply chain bottleneck Semiconductor manufacturing Capacity shortage Supply chain management Technology competition Global semiconductor

ASE sees AI demand stretching packaging capacity into 2030

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digitimes.com 2026-06-25

ASE Holdings COO Dr. Tien Wu revealed that the global semiconductor industry is growing faster than expected due to AI investment, with demand so intense that the company's built capacity over recent years was absorbed almost immediately. This phenomenon highlights the profound impact of AI technolo

Semiconductor packaging AI chip demand Semiconductor capacity ASE Holdings Artificial intelligence development Chip manufacturing Semiconductor industry growth Packaging technology

TSM's Advanced Packaging Capacity Expected to Improve Supply by 2026 - GuruFocus

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www.gurufocus.com 2026-06-15

Taiwan Semiconductor Manufacturing Company's (TSMC) advanced packaging capacity improvements are expected to significantly enhance global chip supply by 2026, addressing current industry capacity constraints. This development represents a crucial advancement for the semiconductor sector, as advanced

Semiconductor Manufacturing Advanced Packaging TSMC Supply Chain Chip Capacity Technology Development Semiconductor Industry Manufacturing Capability

Taiwan Semiconductor's advanced packaging capacity is in short supply, causing orders to spill over to companies such as ASE Technology Holding. - 富途牛牛

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news.futunn.com 2026-06-15

SPIL buys multiple Nanke plants to boost advanced packaging capacity for AI demand - digitimes

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www.digitimes.com 2026-05-04

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