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2026-06-09
digitimes.com
2026-06-09
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.
2026-06-09
digitimes.com
2026-06-09
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup manufacturing and packaging partner for next-generation AI processors.
2026-06-09
digitimes.com
2026-06-09
Optical communications maker PCL Technologies is expanding into high-power laser packaging, with its new Malaysia plant on track to pass customer certification by the end of 2026. Its earlier investment in US silicon photonics firm Skorpios and the acquisition of Pingood Enterprise also form part of the group's co-packaged optics (CPO) strategy.
2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
za.investing.com
2026-06-09
Investing.com South Africa
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
Yahoo Finance
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Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications
Business Wire
Mon, June 8, 2026 at 1:15 PM PDT 2 min read
Q
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Trade Q on Coinbase
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WILMINGTON, Del., June 08, 2026--(BUSINESS WIRE)--Qnity Electronics, Inc. (NYSE: Q), a premier technology
2026-06-09
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2026-06-09
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2026-06-09
www.mycarrollcountynews.com
2026-06-09
Carroll County Mirror-Democrat
Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications
49 mins ago
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Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia
2026-06-09
www.lincolnjournal.com
2026-06-09
lincolnjournal.com
Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications
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2026-06-08
www.bisinfotech.com
2026-06-08
Bisinfotech
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2026-06-08
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2026-06-08
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2026-06-08
digitimes.com
2026-06-08
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the business into a key growth engine and generate more than KRW3 trillion (approx. US$1.9 billion) in annual revenue by 2030.
2026-06-08
digitimes.com
2026-06-08
Apple's M5 Pro signals a broader shift in laptop processors, with implications for global device makers, developers, and AI users. A teardown suggests Apple is combining chiplet-style packaging, higher memory bandwidth, and GPU-based AI acceleration to strengthen on-device computing while reshaping how premium PCs approach local AI workloads.
2026-06-08
digitimes.com
2026-06-08
Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry point into the chip supply chain while wafer fabrication remains a long-term goal. Officials said packaging activities are already underway, as Indian states used Computex in Taipei to attract Taiwanese electronics and AI supply chain investment.
2026-06-07
digitimes.com
2026-06-07
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing, power modules, and next-generation data centers.
2026-06-06
digitimes.com
2026-06-06
Jensen Huang arrived in Seoul on June 5 for what looked like a replay of his Taiwan trip — meetings with Samsung Electronics, SK Hynix, LG Group and Hyundai Motor Group, all companies whose strengths in HBM, advanced packaging, autonomous driving, robotics and smart factories are increasingly tied to Nvidia's future. But his first stop was none of them.