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May 26, 2026
Huawei details fresh chip design philosophy
By Chris Donkin
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The president of Huawei’s semiconductors business department He Tingbo outlined a design methodology set to be used in its upcoming Kirin chips, an approach she backed to provide the means for it to continue to deliver cutting-edge silicon for mobile devices.
In a speech delivered at the 2026 IEE
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Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs...
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2026-05-26
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2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.
2026-05-26
digitimes.com
2026-05-26
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.
2026-05-26
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2026-05-26
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Prohibited by the United States from purchasing EUV lithography machines that make modern chips, Huawei revealed the Tau Law and promises a Kirin 53% denser this fall using a technique that completely dispenses with the technology that China cannot import.
Written by
Douglas Avila
Published on
25/05/2026 at 17:13
Science and Technology
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2026-05-25
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2026-05-25
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Author: He Tingbo, Semiconductor Industry Insights
After six years of research and development, Huawei has completed the mass production of 381 chips.
At ISCAS 2026, He Tingbo of Huawei delivered a keynote speech entitled "Exploration and Practice of New Paths in Semiconductors," in which he introduced a new principle guiding the development of the semiconductor industry—the T Law—aimed at solvi
2026-05-25
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2026-05-25
Wccftech
The U.S. sanctions may have closed Huawei’s trading capabilities with other countries to obtain access to the latest lithography and paraphernalia associated with mass producing next-generation chips, but what it also did was fuel the company’s desire to carve its mark without relying on overseas firms. Today, Huawei announced that by 2031, it will have chips with a manufacturing process equivalen
2026-05-25
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2026-05-25
digitimes
Kawasaki Heavy Industries has opened the Kawasaki Physical AI Center in San Jose to accelerate real-world deployment of physical AI and strengthen Japan–US collaboration in AI and semiconductors. Located in Silicon Valley, the center aims to develop practical...
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