How can Huawei break through in the high-end chip market without advanced lithography machines? What is Huawei's "Tao (τ) Law"? - PANews

After six years of research and development, Huawei has successfully achieved mass production of 381 chips. At ICSAS 2026, He Tingbo of Huawei presented a keynote titled 'Exploration and Practice of N... Read original →

Huawei’s 'Tau Law' isn't a workaround—it's a systemic response to Moore’s Law exhaustion. Technically, it accelerates adoption of 3D stacking, optoelectronic interconnects, and logic folding, forcing EDA, advanced packaging, and Chiplet ecosystems—especially OSATs in Taiwan, China and mainland China—to adapt. While bypassing EUV eases U.S. lithography sanctions, Washington may tighten controls on GAA materials or AI-related IP, raising hidden R&D costs. Competitively, TSMC and Samsung will likely double down on 2nm GAA and silicon photonics to preserve 'node leadership' narratives, while NVIDIA may enhance CPO and NVLink time-optimization tactics. If validated in Ascend AI chips or HarmonyOS devices within 18 months, Tau scaling could trigger a global shift from process-node obsession to time-energy efficiency as the new semiconductor benchmark.