Semiconductor News & Analysis Feed
29 articles
2026-06-17
digitimes.com
2026-06-17
Semiconductor manufacturers, market analysts, and engineering departments have long tracked the clean energy transition through siloed vertical markets. For example, they will calculate individual EV sales on one spreadsheet while tracking hyperscale data center deployments on another. However, during PCIM Europe 2026 in Nuremberg, Germany, industry leaders and experts discussed and dismantled thi
2026-06-13
digitimes.com
2026-06-13
During a panel discussion between executives and research experts from Bosch, Infineon, Rohm Semiconductor, Nexperia, Wolfspeed, and Omdia at PCIM Europe 2026, one reality was made clear: frictionless, globalized chip manufacturing is ending. While the conversation reflected industry enthusiasm for new applications such as AI servers and industrial motor drives, it was tempered by macroeconomic re
2026-06-12
digitimes.com
2026-06-12
In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: wi
2026-06-11
digitimes.com
2026-06-11
While marketing initiatives promote an ultra-fast transition to wide-bandgap (WBG) semiconductors, fully automated smart factories, and an all-electric automotive future, the sentiment across the PCIM Europe 2026 exhibition floor is more pragmatic. The industry has reached a transitional maturity wall where the realities of material physics, fragmented design silos, and macroeconomic supply shocks
2026-06-10
digitimes.com
2026-06-10
Global hardware growth is facing an increasingly fragile and fragmented supply chain. At PCIM Europe 2026, software intelligence firm Luminovo's OEM Growth Lead, Inga Schwarz, made a compelling case for why AI is no longer enough to save hardware companies from costly operational challenges. The industry, she argued, must embrace a transition toward deep, native domain enterprise integration to bu
2026-06-05
electronics360.globalspec.com
2026-06-05
Electronics360
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2026-06-02
news.google.com
2026-06-02
EE Times Asia
2026-06-01
electronics360.globalspec.com
2026-06-01
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2026-05-27
www.eletimes.ai
2026-05-27
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HomeElectronicsInfineon Exhibits Semiconductor Solutions for Power Infrastructure, AI Data Centers, Robotics, and...
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Infineon Exhibits Semiconductor Solutions for Power Infrastructure, AI Data Centers, Robotics, and Electromobility at PCIM Europe 2026
ELE Times News
May 27, 2026
PCIM 2026
At PCIM Europe 2026 in Nuremberg
2026-05-27
www.eqs-news.com
2026-05-27
EQS News
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2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 Deutschland - English
VOM NACHRICHTENDIENST
USI
27 Mai, 2026, 05:00 GMT
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor pa
2026-05-27
www.thailand-business-news.com
2026-05-27
Thailand Business News
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2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English
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27 May, 2026, 07:00 CST
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
us.acrofan.com
2026-05-27
acrofan.com
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
Visit ROHM at booth 318 in hall 9
Demonstrating cutting edge power semiconductor technologies.
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Santa Clara, CA and Willich/Nuremberg, Germany, May 26, 2026 (GLOBE NEWSWIRE) --
2026-05-27
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2026-05-27
Taiwan News
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2026-05-27
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2026-05-27
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2026-05-26
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2026-05-26
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2026-05-26
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2026-05-26
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