Semiconductor News & Analysis Feed
20 articles
2026-06-05
electronics360.globalspec.com
2026-06-05
Cosmic's unveiling of its latest high-power semiconductor testing platforms at PCIM Europe 2026 represents a significant advancement in semiconductor testing technology. As the premier global exhibition for power electronics, semiconductor, and energy management technologies, PCIM Europe provides a
2026-06-02
news.google.com
2026-06-02
2026-06-01
electronics360.globalspec.com
2026-06-01
At PCIM Europe 2026, EPC showcased its gallium nitride (GaN) power solutions across emerging technologies including robotics, drones, and AI servers, highlighting GaN's superior efficiency and performance advantages. This demonstration underscores the growing industry demand for high-efficiency, com
2026-05-27
www.eletimes.ai
2026-05-27
At PCIM Europe 2026 in Nuremberg, Infineon Technologies showcased a comprehensive portfolio of semiconductor solutions targeting future-proof power infrastructure, AI data centers, robotics, and electromobility. The company exhibited a broad range of power system technologies based on silicon (Si),
2026-05-27
www.eqs-news.com
2026-05-27
On May 27, 2026, USI, a global leader in electronic design and manufacturing services, unveiled advanced silicon carbide (SiC) chip-embedded packaging technology at PCIM Europe 2026. The innovation integrates SiC dies into multilayer ABF substrates using Single-Side Copper Exposed (SSC) module packa
2026-05-27
www.prnewswire.com
2026-05-27
On May 27, 2026, USI, a global leader in electronic design and manufacturing services, unveiled breakthrough advancements in advanced power semiconductor packaging technology at PCIM Europe 2026. The company showcased its capability to embed silicon carbide (SiC) dies into multilayer ABF substrates
2026-05-27
www.thailand-business-news.com
2026-05-27
USI's advanced SiC chip-embedded packaging technology showcased at PCIM Europe 2026 represents a significant breakthrough in power semiconductor technology. SiC, as a third-generation semiconductor material, offers superior performance characteristics including high power density, efficiency, and th
2026-05-27
www.manilatimes.net
2026-05-27
On May 27, 2026, USI, a global leader in electronic design and manufacturing services, announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. The company successfully embedded silicon carbide (SiC) dies into multilayer ABF substrat
2026-05-27
www.prnewswire.com
2026-05-27
On May 27, 2026, USI, a global leader in electronic design and manufacturing services, unveiled breakthrough advancements in advanced power semiconductor packaging technology at PCIM Europe 2026. The company showcased its innovative approach of embedding silicon carbide (SiC) dies into multilayer AB
2026-05-27
us.acrofan.com
2026-05-27
USI, a global leader in electronic design and manufacturing services, has unveiled a breakthrough in advanced power semiconductor packaging technology at PCIM Europe 2026. The company successfully embedded silicon carbide (SiC) dies into multilayer ABF substrates and integrated ceramic substrate ins
2026-05-27
www.manilatimes.net
2026-05-27
ROHM Semiconductor will exhibit at PCIM Expo & Conference 2026, the leading international event for power electronics, intelligent motion, renewable energy and energy management, taking place June 9–11, 2026 in Nuremberg, Germany. At booth 318 in Hall 9, ROHM will showcase its latest advancements in
2026-05-27
www.taiwannews.com.tw
2026-05-27
ROHM showcased its latest advancements in silicon carbide power technology at the 2026 PCIM Europe exhibition, highlighting significant developments for electric mobility and industrial applications. As a leading global provider of power semiconductor solutions, ROHM reinforced its market position i
2026-05-27
ca.finance.yahoo.com
2026-05-27
2026-05-26
www.01net.it
2026-05-26
Magnachip plans to showcase its MV MOSFET portfolio at the 2026 PCIM Europe exhibition, focusing on AI server and data center applications. This presentation will be alongside the company's broader power semiconductor product line, demonstrating its technological capabilities in high-performance pow
2026-05-26
www.morningstar.com
2026-05-26
2026-05-26
news.google.com
2026-05-26
2026-05-26
news.google.com
2026-05-26
2026-05-26
2026-05-26
www.bisinfotech.com
2026-05-26
2026-05-26
www.bisinfotech.com
2026-05-26