Semiconductor News & Analysis Feed
615 articles
2026-06-12
www.digitimes.com
2026-06-12
digitimes
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these...
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2026-06-12
digitimes.com
2026-06-12
In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: wi
2026-06-12
digitimes.com
2026-06-12
Chinese PC major Lenovo is reportedly set to raise prices across its entire product line from July 2026, with increases broadly in line with its first round of adjustments in March. Retail prices for some models could rise by as much as CNY1,000 (approx. US$148).
2026-06-12
digitimes.com
2026-06-12
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers and supply chains, the shift suggests stronger demand for Taiwan's packaging and testing firms, alongside a broader rebalancing of semiconductor production.
2026-06-12
digitimes.com
2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-11
news.google.com
2026-06-11
PC Guide
2026-06-11
www.pcmag.com
2026-06-11
PCMag
Memory is in short supply, and GPU generations are delayed, so there's been a lot of talk of older cards making a comeback. But while Nvidia board partner Manli's 12GB RTX 3060 re-release makes sense, the RTX 3050 it's re-launching alongside it with a mere 6GB of VRAM is a harder sell.
The RTX 5050 is already available at less than $300, and on-board graphics offers more compelling performance in
2026-06-11
www.pcmag.com
2026-06-11
PCMag
AMD isn't taking Nvidia's recent performance projections on its new Vera CPUs lying down. After Team Green approved some Phoronix test results showing Vera beating AMD's Epyc server chips in several tests, AMD has released estimated comparisons of its next-generation Venice Epyc chips based on its Zen 6 architecture, Tom's Hardware reports. It claims the per-rack performance of its new chips could
2026-06-11
tomshardware.com
2026-06-11
Mark Tyson
A Redditor's powerful gaming PC just might have just saved their life after its splintered G.Skill RAM sticks diverted a bullet shot through the wall.
2026-06-11
finance.yahoo.com
2026-06-11
Yahoo Finance
Musk to Address ASML Event as SpaceX IPO Nears and Terafab Plans Advance (SPCX)
Fiona Craig
Thu, June 11, 2026 at 3:44 AM PDT 3 min read
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Elon Musk is set to make a virtual appearance at a technology event hosted by semiconductor equipment leader ASML on Thursday, where he is expected
2026-06-11
digitimes.com
2026-06-11
AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end ABF substrate market. HVLP4 copper foil is set to become the next constraint in the second half of 2026.
2026-06-11
digitimes.com
2026-06-11
While marketing initiatives promote an ultra-fast transition to wide-bandgap (WBG) semiconductors, fully automated smart factories, and an all-electric automotive future, the sentiment across the PCIM Europe 2026 exhibition floor is more pragmatic. The industry has reached a transitional maturity wall where the realities of material physics, fragmented design silos, and macroeconomic supply shocks
2026-06-11
blog.adafruit.com
2026-06-11
Adafruit
blog.adafruit.com
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2026-06-11
tomshardware.com
2026-06-11
Hassam Nasir
The physical die and package size have shrunk compared to current-gen offerings.
2026-06-10
www.hpcwire.com
2026-06-10
HPCwire
www.hpcwire.com
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2026-06-10
www.techpowerup.com
2026-06-10
TechPowerUp
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2026-06-10
www.01net.it
2026-06-10
01net
www.01net.it
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2026-06-10
www.eagletribune.com
2026-06-10
Eagle-Tribune
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2026-06-10
news.google.com
2026-06-10
Business Wire
2026-06-10
digitimes.com
2026-06-10
Global hardware growth is facing an increasingly fragile and fragmented supply chain. At PCIM Europe 2026, software intelligence firm Luminovo's OEM Growth Lead, Inga Schwarz, made a compelling case for why AI is no longer enough to save hardware companies from costly operational challenges. The industry, she argued, must embrace a transition toward deep, native domain enterprise integration to bu