www.thelec.net
2026-09-01
Applied Materials has unveiled advancements in next-generation three-dimensional (3D) semiconductor scaling technologies, addressing the growing compute demands of artificial intelligence (AI) models. As AI applications intensify, the industry faces challenges such as the 'memory wall,' which limits
www.kucoin.com
2026-06-22
Intel CEO Chen Liwu has set a bold 10x return target for Intel over the next 5–10 years, focusing on advanced packaging, novel semiconductor materials, and next-generation substrate technologies. As traditional process scaling faces physical limitations, Chen emphasizes a strategic pivot toward mate