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2026-11-13
SK Hynix, Intel explore shared memory to ease AI bottlenecks
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digitimes.com 2026-11-13
2026-11-12
Connecting AI to the Physical World
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eetimes.com 2026-11-12
2026-11-12
DAMO Academy's XuanTie XL-300 Interconnect IP Links Up to Eight RISC-V Cores With 32MB of L3 - Pandaily
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pandaily.com 2026-11-12
2026-11-12
AI bottleneck shifts from compute to power; European supply chain sees power semiconductors as next shortage
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digitimes.com 2026-11-12
2026-11-12
Credo at OCP 2026: Micro-Emitter Optics and AI Interconnect Reliability
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eetimes.com 2026-11-12
2026-11-11
Staera Semiconductor Emerges from Stealth with US$4.6 Million to Build Light into the Chip and Break AI's Data Bottleneck - Embedded Computing Design
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embeddedcomputing.com 2026-11-11
2026-11-11
AI Data Centre Demand Triggers Automotive Chip Bottlenecks - ACKO Drive
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ackodrive.com 2026-11-11
2026-11-11
UCIe Connectivity for 2.5D and 3D Multi-Die Designs
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semiengineering.com 2026-11-11
2026-11-11
Nvidia's OOI architecture paves way for optical interconnects in GPUs
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digitimes.com 2026-11-11
2026-11-10
Nokia eyes AI optical interconnect market, potentially challenging Lumentum and Coherent
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digitimes.com 2026-11-10
2026-11-10
Exclusive: Quantum without quantum computers — Quinas bets on quantum tunneling to break AI's memory bottleneck
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digitimes.com 2026-11-10
2026-11-10
Research Insight: FIT expands liquid cooling connector lineup for Vera Rubin NVL72
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digitimes.com 2026-11-10
2026-11-06
Innolight starts US NPO pilot production with Tower for AI optical interconnects
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digitimes.com 2026-11-06
2026-11-05
Texas Instruments Launches Multiprotocol Ethernet Module to Simplify Industrial Connectivity - ELE Times
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www.eletimes.ai 2026-11-05
2026-11-05
TI simplifies Industrial Ethernet integration for connected factories with the industry's smallest fully featured, multiprotocol communications module - Star Local Media
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starlocalmedia.com 2026-11-05
2026-11-05
Corning starts optical connectivity output in western India, plans larger adjacent plant for 2027
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digitimes.com 2026-11-05
2026-11-03
Marvell Snaps Photonics Chipmaker Lumentum to Bolster AI Connectivity
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eetimes.com 2026-11-03
2026-11-03
AI Image Enhancement Improves Detection Of Flip-Chip Interconnect Defects (MCL, PVA TePla, ASE)
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semiengineering.com 2026-11-03
2026-11-03
Donovan’s Deep Dives: TSMC’s overseas expansion is a necessity, not a choice - Taipei Times
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www.taipeitimes.com 2026-11-03
2026-11-02
Foxconn's FII, FIT join forces to tackle AI data center bottlenecks beyond computing power
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digitimes.com 2026-11-02