Semiconductor News & Analysis Feed
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2026-05-27
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2026-05-27
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Europe Launches New Chip/Packaging R&D Projects
These projects include GaN/SiC packaging, quasi-monolithic integration, 3D qub
2026-05-27
us.acrofan.com
2026-05-27
acrofan.com
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
developer.nvidia.com
2026-05-27
NVIDIA Developer
NVIDIA CUDA 13.3 brings new capabilities and performance optimizations to developers across the CUDA ecosystem. The launch of NVIDIA CUDA Tile programming in C++, enables high-level, tile-based kernel development that automatically manages complex low-level GPU details for optimal performance and portability. Additionally, CUDA Tile programming is now supported on Compute Capability 9.0 (NVIDIA Ho
2026-05-27
www.ibtimes.com
2026-05-27
International Business Times
By
Merin Rebecca Thomas
Published 05/26/26 AT 5:55 PM EDT
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ByteDance plans to purchase millions of Qualcomm application-specific integrated circuits, or ASICs, to support its AI agent software and broader artificial intelligence operations. AFP
Qualcomm has secured a deal to supply artificial intelligence ch
2026-05-27
developer.nvidia.com
2026-05-27
NVIDIA Developer
NVIDIA CompileIQ tackles one of the hardest problems in performance engineering: finding the compiler options that unlock the best performance for a specific workload.
Consider a team that has spent weeks optimizing an LLM inference pipeline on GPUs, tuning batch sizes, quantizing to FP8, adopting flash attention, fusing every kernel they can. The profiler says there’s nothing left to squeeze.
B
2026-05-27
developer.nvidia.com
2026-05-27
NVIDIA Developer
Developers can now use NVIDIA CUDA Tile programming within large existing C++ GPU codebases to develop highly optimized GPU kernels using tile-based abstractions.
NVIDIA CUDA Tile, launched with NVIDIA CUDA 13.1, introduced tile-based programming for GPUs. Designed with a top-level language layer and another intermediate layer that any high-level programming language can target, CUDA Tile autom
2026-05-27
blogs.nvidia.com
2026-05-27
NVIDIA Blog
NVIDIA Vera CPU Is ‘Packing a Heavy-Hitting Punch’ Against Competition
In the new Phoronix benchmark, Vera delivers winning performance and memory results for agentic AI.
May 26, 2026 by Diana Aung
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The shift to agentic AI creates a new CPU requirement for the AI factory: fast cores, massive memory bandwidth and the ability to sustain high performance when all cores are active.
Initial
2026-05-27
finance.yahoo.com
2026-05-27
Yahoo Finance
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2026-05-27
uk.finance.yahoo.com
2026-05-27
Yahoo Finance UK
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2026-05-27
www.cfodive.com
2026-05-27
CFO Dive
DIVE BRIEF
Nvidia CEO urges Super Micro to tighten compliance: reports
Super Micro said in a statement that recent events “underscore the need for industry-wide solutions to “strengthen enforcement of export control laws.”
Published May 26, 2026
Maura Webber Sadovi
Senior Editor
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Nvidia CEO Jensen Huang delivers the keynote address during the Nvidia GTC 2025 at SAP
2026-05-27
news.google.com
2026-05-27
MarketWatch
2026-05-27
finance.yahoo.com
2026-05-27
Yahoo Finance
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2026-05-27
letsdatascience.com
2026-05-27
Let's Data Science
FUNDING & BUSINESS
micron
memory hbm
roundhill etf
semiconductor etfs
Micron Rally Boosts AI Memory ETFs and Funds
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May 26, 2026
6.9
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Photo: cdn.benzinga.com · rights & takedowns
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Micron Technology's 2026 surge in AI memory demand is lifting semiconductor ETFs and AI-infrastructure funds, according to coverage from 247wallst and Yahoo Finance. The newly
2026-05-27
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2026-05-27
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2026-05-27
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2026-05-27
Yahoo! Finance Canada
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2026-05-27
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2026-05-27
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2026-05-27
www.globenewswire.com
2026-05-27
GlobeNewswire
Collaborative R&D at Applied’s EPIC Center in Silicon Valley will enable higher yields and faster commercialization of next-generation chips
Partnership deepens long-standing joint development relationship to overcome process challenges in leading-edge chipmaking
SANTA CLARA, Calif., May 26, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering solut
2026-05-27
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2026-05-27
Yahoo Finance
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2026-05-27
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2026-05-27
Gizmochina
2026-05-27
finance.yahoo.com
2026-05-27
Yahoo Finance
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