Europe Launches New Chip/Packaging R&D Projects - Semiecosystem

Europe has launched several new semiconductor and packaging R&D initiatives aimed at strengthening its global competitiveness in the industry. The Moore4Power project, led by Infineon, focuses on adva... Read original →

Europe’s new R&D wave is a geopolitical countermove, not just a tech sprint. Moore4Power’s heterogeneous SiC/GaN integration will force Lam and Zeiss to accelerate multi-material EUV modules, while triggering demand for 300mm SiC substrates and panel-level packaging tools. However, heavy reliance on mature-node foundries in Taiwan, China clashes with the EU Chips Act’s 20% localization mandate, inflating Infineon’s supply chain costs. The U.S. may retaliate by luring Imec’s quantum photonics talent via CHIPS subsidies, while SMIC could seize GaN power-device outsourcing opportunities. If Europe fails within 18 months to validate an end-to-end stack—from ultra-pure SiC crystal growth to 3D qubit interconnects—its 'technological sovereignty' ambition risks becoming a capital sink.