Semiconductor News & Analysis Feed
5904 articles
2026-05-27
digitimes.com
2026-05-27
TSMC chairman and CEO C.C. Wei addressed employees at a company-wide meeting on May 27, making a direct commitment on bonuses after days of backlash over reports of a 15% cut.
2026-05-27
www.marketscreener.com
2026-05-27
marketscreener.com
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2026-05-27
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2026-05-27
TradingView
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2026-05-27
insurancenewsnet.com
2026-05-27
InsuranceNewsNet
insurancenewsnet.com
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
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2026-05-27
aijourn.com
2026-05-27
The AI Journal
BILLERICA, Mass. & TOKYO–(BUSINESS WIRE)–Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, today announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet
2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.01net.it
2026-05-27
01net
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2026-05-27
news.google.com
2026-05-27
Business Wire
2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English
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USI
27 May, 2026, 07:00 CST
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
www.fool.com
2026-05-27
The Motley Fool
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2026-05-27
finance.yahoo.com
2026-05-27
Yahoo Finance
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2026-05-27
eetimes.com
2026-05-27
The most important takeaway everyone missed at the 2026 Google I/O Conference.
2026-05-27
marklapedus.substack.com
2026-05-27
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Europe Launches New Chip/Packaging R&D Projects
These projects include GaN/SiC packaging, quasi-monolithic integration, 3D qub
2026-05-27
us.acrofan.com
2026-05-27
acrofan.com
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
developer.nvidia.com
2026-05-27
NVIDIA Developer
NVIDIA CUDA 13.3 brings new capabilities and performance optimizations to developers across the CUDA ecosystem. The launch of NVIDIA CUDA Tile programming in C++, enables high-level, tile-based kernel development that automatically manages complex low-level GPU details for optimal performance and portability. Additionally, CUDA Tile programming is now supported on Compute Capability 9.0 (NVIDIA Ho
2026-05-27
www.ibtimes.com
2026-05-27
International Business Times
By
Merin Rebecca Thomas
Published 05/26/26 AT 5:55 PM EDT
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ByteDance plans to purchase millions of Qualcomm application-specific integrated circuits, or ASICs, to support its AI agent software and broader artificial intelligence operations. AFP
Qualcomm has secured a deal to supply artificial intelligence ch
2026-05-27
developer.nvidia.com
2026-05-27
NVIDIA Developer
NVIDIA CompileIQ tackles one of the hardest problems in performance engineering: finding the compiler options that unlock the best performance for a specific workload.
Consider a team that has spent weeks optimizing an LLM inference pipeline on GPUs, tuning batch sizes, quantizing to FP8, adopting flash attention, fusing every kernel they can. The profiler says there’s nothing left to squeeze.
B
2026-05-27
developer.nvidia.com
2026-05-27
NVIDIA Developer
Developers can now use NVIDIA CUDA Tile programming within large existing C++ GPU codebases to develop highly optimized GPU kernels using tile-based abstractions.
NVIDIA CUDA Tile, launched with NVIDIA CUDA 13.1, introduced tile-based programming for GPUs. Designed with a top-level language layer and another intermediate layer that any high-level programming language can target, CUDA Tile autom
2026-05-27
blogs.nvidia.com
2026-05-27
NVIDIA Blog
NVIDIA Vera CPU Is ‘Packing a Heavy-Hitting Punch’ Against Competition
In the new Phoronix benchmark, Vera delivers winning performance and memory results for agentic AI.
May 26, 2026 by Diana Aung
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The shift to agentic AI creates a new CPU requirement for the AI factory: fast cores, massive memory bandwidth and the ability to sustain high performance when all cores are active.
Initial