Semiconductor News & Analysis Feed
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2026-05-29
Nikkei Asia
Move a win for US chip titan as it looks to secure customers for foundry services
Mediatek says it is now "one of the few" chip designers able to support customers using advanced packaging technologies from both Taiwan Semiconductor Manufacturing Co. and Intel. (Source photos by Cheng Ting-Fang and Reuters)
TAIPEI -- MediaTek says it has started working with Intel for advanced chip packaging in
2026-05-29
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2026-05-29
The Motley Fool
Nvidia (
NVDA
+0.80%
) is at the center of the artificial intelligence (AI) revolution, and the company is trying to secure its future in the industry. One way it is doing so is through heavy R&D investments. Another is by investing in other promising AI-focused companies. Two of them, Intel (
INTC
0.72%
) and CoreWeave (
CRWV
+2.50%
), accounted for about 71.6% of its portfolio as of March 31. Gi
2026-05-29
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2026-05-29
WKZO
By Eduardo Baptista and Che Pan
BEIJING, May 29 (Reuters) – Huawei’s new chip design principle focused on boosting transmission speed rather than continuing to shrink semiconductors offers a path for China to build cutting-edge chips despite U.S. sanctions, though whether it represents a true breakthrough remains to be seen.
China has been barred since 2019 from importing ASML’s most advanced ex
2026-05-29
wtvbam.com
2026-05-29
WTVB
By Eduardo Baptista and Che Pan
BEIJING, May 29 (Reuters) – Huawei’s new chip design principle focused on boosting transmission speed rather than continuing to shrink semiconductors offers a path for China to build cutting-edge chips despite U.S. sanctions, though whether it represents a true breakthrough remains to be seen.
China has been barred since 2019 from importing ASML’s most advanced ex
2026-05-29
www.bisinfotech.com
2026-05-29
Bisinfotech
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2026-05-29
Automotive World
Infineon has introduced a 1300 V SiC power module operating at 205°C, 30 degrees above the industry standard, for EV inverter use
May 29, 2026
Infineon Technologies has introduced a 1300 V silicon carbide (SiC) power module for electric vehicle (EV) inverters, the first within its HybridPACK Drive family capable of continuous operation at 205°C, a 30°C increase over the 175°C industry standard.
2026-05-29
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2026-05-29
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