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Equipped with Cooling Component (ICE) Inside HBM Package Over 30% Reduction in Thermal Resistance Proven MR-MUF Process Applied Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue. On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize

Equipped with Cooling Component (ICE) Inside HBM Package Over 30% Reduction in Thermal Resistance Proven MR-MUF Process Applied Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue. On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize