Semiconductor News & Analysis Feed

38 articles
2026-07-07
tomshardware.com 2026-07-07 Anton Shilov
Kioxia, Sandisk begin to sample BiCS10 3D NAND: 332 active layers and over 29 Gb/mm2 areal capacity.
2026-07-01
digitimes.com 2026-07-01
India's proposed second phase of the India Semiconductor Mission (ISM 2.0) has reportedly taken a key step forward, clearing the Finance Ministry's Expenditure Finance Committee (EFC), according to Indian media reports. The development could pave the way for a broader expansion of the country's semiconductor manufacturing ambitions.
2026-06-28
digitimes.com 2026-06-28
As advanced semiconductor processes rapidly transition from 28nm to 3nm and 2nm nodes, more frequent chemical cleaning procedures are driving an increase in demand for liquid chemical waste treatment. Techzone Chairman Chen Li-Li said that semiconductor companies are currently pursuing two major approaches in response to ESG requirements: first, establishing outsourced waste treatment channels; an
2026-06-25
www.indexbox.io 2026-06-25 IndexBox
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2026-06-25
boisedev.com 2026-06-25 BoiseDev
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2026-06-22
finance.yahoo.com 2026-06-22 Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries. Vadzo Imaging Introduces Falcon-821CRH Onsemi AR0821 M12 Autofocus Camera with 4K HDR Imaging for Fundus Camera OEMs Vadzo Imaging Mon, June 22, 2026 at 7:30 AM PDT 14 min read The Falcon-821CRH is an 8MP Color Rolling Shutter USB 3.2 Gen 1 Camera with VCM Autofocus, built on the Onsemi AR0821 sensor.
2026-06-22
markets.financialcontent.com 2026-06-22 FinancialContent
Vadzo Imaging Introduces Falcon-821CRH Onsemi AR0821 M12 Autofocus Camera with 4K HDR Imaging for Fundus Camera OEMs By: Vadzo Imaging via ACCESS Newswire June 22, 2026 at 10:30 AM EDT ⓘ This article is third-party content and does not represent the views of this site. We make no guarantees regarding its accuracy or completeness. The Falcon-821CRH is an 8MP Color Rolling Shutter USB 3.2 Gen 1 Cam
2026-06-22
www.newswire.com 2026-06-22 Newswire.com
Vadzo Imaging Introduces Falcon-821CRH Onsemi AR0821 M12 Autofocus Camera with 4K HDR Imaging for Fundus Camera OEMs PRESS RELEASE • JUN 22, 2026 14:30 UTC The Falcon-821CRH is an 8MP Color Rolling Shutter USB 3.2 Gen 1 Camera with VCM Autofocus, built on the Onsemi AR0821 sensor. It is designed for fundus camera OEMs, ophthalmic diagnostics instrument manufacturers, retinal imaging system integr
2026-06-17
www.digitimes.com 2026-06-17 digitimes
Semiconductor manufacturers, market analysts, and engineering departments have long tracked the clean energy transition through siloed vertical markets. For example, they will calculate individual EV sales on one spreadsheet while tracking hyperscale data... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time th
2026-06-17
digitimes.com 2026-06-17
Semiconductor manufacturers, market analysts, and engineering departments have long tracked the clean energy transition through siloed vertical markets. For example, they will calculate individual EV sales on one spreadsheet while tracking hyperscale data center deployments on another. However, during PCIM Europe 2026 in Nuremberg, Germany, industry leaders and experts discussed and dismantled thi
2026-06-15
www.moomoo.com 2026-06-15 Moomoo
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2026-06-15
www.trendforce.com 2026-06-15 TrendForce
[News] TSMC CoWoS Supply-Demand Gap Reportedly Seen Narrowing from 20% to 10% by End-2026 2026-06-15 Semiconductors editor News Please note that this article cites information from Economic Daily News, Reuters. and Commercial Times. TSMC continues to accelerate its advanced packaging capacity expansion, helping move the industry closer to supply-demand balance. According to Economic Dail
2026-06-13
news.google.com 2026-06-13 digitimes
2026-06-13
digitimes.com 2026-06-13
During a panel discussion between executives and research experts from Bosch, Infineon, Rohm Semiconductor, Nexperia, Wolfspeed, and Omdia at PCIM Europe 2026, one reality was made clear: frictionless, globalized chip manufacturing is ending. While the conversation reflected industry enthusiasm for new applications such as AI servers and industrial motor drives, it was tempered by macroeconomic re
2026-06-12
www.cnx-software.com 2026-06-12 CNX Software
POSTED ON JUNE 12, 2026 BY JEAN-LUC AUFRANC (CNXSOFT) - 1 COMMENT ON FORTIOR FU75XX DUAL-CORE MOTOR CONTROL MCU FAMILY COMBINES 32-BIT RISC-V CORE WITH 2ND-GEN MOTOR ENGINE (ME2) CORE Fortior FU75xx dual-core motor control MCU family combines 32-bit RISC-V core with 2nd-gen Motor Engine (ME2) core Motor driver IC specialist Fortior Technology has recently introduced the FU75xx dual-core motor con
2026-06-12
www.digitimes.com 2026-06-12 digitimes
In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they
2026-06-12
www.digitimes.com 2026-06-12 digitimes
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they
2026-06-12
digitimes.com 2026-06-12
In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: wi
2026-06-12
digitimes.com 2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-11
digitimes.com 2026-06-11
While marketing initiatives promote an ultra-fast transition to wide-bandgap (WBG) semiconductors, fully automated smart factories, and an all-electric automotive future, the sentiment across the PCIM Europe 2026 exhibition floor is more pragmatic. The industry has reached a transitional maturity wall where the realities of material physics, fragmented design silos, and macroeconomic supply shocks