Semiconductor News & Analysis Feed
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2026-06-15
simplywall.st
2026-06-15
simplywall.st
Japan/Semiconductors/TSE:6963
Is ROHM (TSE:6963) Quietly Recasting Its Power-Semiconductor Edge Through Targeted SiC Design Wins?
June 15, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
ROHM recently introduced its TSC3PAK surface-mount package for SiC MOSFETs for xEV onboard chargers, electric compressors and industrial power systems, while its 750 V SiC MOSFETs were adopted in battery backup un
2026-06-15
www.tweaktown.com
2026-06-15
TweakTown
Google is in talks with Samsung to build next-gen 'Icefish' TPU on 1.4nm and 2nm process split
Google's Icefish TPU may be split between Samsung and TSMC, with 1.4nm compute dies and 2nm memory I/O targeting a 2028 production timeline.
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Hassam Nasir
Tech Reporter
Published Jun 14, 2026 8:30 PM CDT
2-minute read time
TL;DR: Google is reportedly planning a multi-foundry strategy fo
2026-06-15
www.morningstar.com
2026-06-15
Morningstar
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Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
Provided by PR Newswire Jun 15, 2026, 9:00:00 AM
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconducto
2026-06-15
www.streetinsider.com
2026-06-15
StreetInsider
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2026-06-15
www.prnewswire.com
2026-06-15
PR Newswire
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
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Rapidus Corporation
Jun 14, 2026, 21:00 ET
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New collaboration provides framework between the Japan government and the UK
TOKYO, June 14, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the UK Semiconduct
2026-06-15
uk.finance.yahoo.com
2026-06-15
Yahoo Finance UK
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Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
PR Newswire
Sun, 14 June 2026 at 6:00 pm GMT-7 3 min read
New collaboration provides framework between the Japan government and the UK
TOKYO, June 14, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it
2026-06-15
www.techtimes.com
2026-06-15
Tech Times
By Allen Lee
Published: Jun 14 2026, 20:45 PM EDT
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The TSMC logo is displayed at the Taiwan Semiconductor Manufacturing Company branch and Innovation Museum, highlighting the company branding and signage inside and outside the site in Hsinchu, Taiwan, January 27, 2026. JIMMY BEUNARDEAU/GETTY IMA
2026-06-15
www.techtimes.com
2026-06-15
Tech Times
By Allen Lee
Published: Jun 14 2026, 20:45 PM EDT
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The TSMC logo is displayed at the Taiwan Semiconductor Manufacturing Company branch and Innovation Museum, highlighting the company branding and signage inside and outside the site in Hsinchu, Taiwan, January 27, 2026. JIMMY BEUNARDEAU/GETTY IMA
2026-06-15
www.techtimes.com
2026-06-15
Tech Times
By Allen Lee
Published: Jun 14 2026, 20:45 PM EDT
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A photo taken on May 19, 2026 shows the US multinational technology and Internet-related services company Google displayed on a smartphone (bottom) in front of the Google's logo on a laptop screen in Frankfurt am Main, western Germany. KIRILL KU
2026-06-15
www.techtimes.com
2026-06-15
Tech Times
By Allen Lee
Published: Jun 14 2026, 20:42 PM EDT
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Tower cranes are seen at the construction site of the Samsung Electronics factory in Pyeongtaek on May 28, 2026. SHIN YONG-JU/AFP VIA GETTY IMAGES
Samsung Electronics expects its foundry business to return to annual profitability in 2028 — late
2026-06-15
www.techtimes.com
2026-06-15
Tech Times
By Allen Lee
Published: Jun 14 2026, 20:42 PM EDT
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Tower cranes are seen at the construction site of the Samsung Electronics factory in Pyeongtaek on May 28, 2026. SHIN YONG-JU/AFP VIA GETTY IMAGES
Samsung Electronics expects its foundry business to return to annual profitability in 2028 — late
2026-06-15
news.google.com
2026-06-15
Tech Times
2026-06-15
www.indexbox.io
2026-06-15
IndexBox
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2026-06-15
digitimes.com
2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
2026-06-15
digitimes.com
2026-06-15
INPAQ Technology, a unit of PSA Walsin Technology, reported that revenue and profit in the first quarter of 2026 fell year on year, citing a supply-demand imbalance in the memory market and sharp raw material price increases. The company said it expected a gradual recovery in the second half of 2026 as industry inventories normalized and new products and customers began contributing. INPAQ also ou
2026-06-15
digitimes.com
2026-06-15
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical communications market. Taiwanese compound semiconductor suppliers including Visual Photonics Epitaxy (VPEC) and Global Communication Semiconductors (GCS)
2026-06-15
digitimes.com
2026-06-15
Walsin Technology expects the tight supply of passive components could last into 2028, as demand from AI infrastructure, automotive electronics, and future device upgrades lifts orders while memory shortages weigh on shipments across the broader electronics supply chain.
2026-06-15
digitimes.com
2026-06-15
Nvidia CEO Jensen Huang's recent trip to South Korea put the spotlight on the rivalry between Samsung Electronics and SK Hynix, while memory giant Micron crossed the US$1 trillion market-cap mark for the first time. That shift has also drawn global attention to Micron CEO Sanjay Mehrotra, whose rise began with a string of dramatic visa rejections 50 years ago.
2026-06-15
digitimes.com
2026-06-15
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
Tsang Yow is preparing to broaden its manufacturing footprint in Malaysia, a move that could help global semiconductor supply chains become more regional, resilient, and tariff-proof. The drivetrain systems maker expects trial production at the new plant before the end of 2026, as demand tied to artificial intelligence and advanced chips reshapes sourcing patterns worldwide.