Semiconductor News & Analysis Feed
1217 articles
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.
2026-05-26
digitimes.com
2026-05-26
Following the conclusion of the Trump-Xi meeting and amid continued delays in China approving imports of Nvidia H20 GPUs, China's National Development and Reform Commission (NDRC) on May 22 sent a strong policy signal on artificial intelligence (AI) self-sufficiency, explicitly calling for greater efforts to pair domestic large language models with domestically developed computing chips.
2026-05-26
digitimes.com
2026-05-26
AI servers are driving a surge in demand for high-end passive components, rapidly eating into multilayer ceramic capacitor (MLCC) capacity and extending lead times to more than 16–20 weeks. As a result, some orders that once went to major Japanese and South Korean suppliers are gradually spilling over to Taiwan-based makers.
2026-05-26
digitimes.com
2026-05-26
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.
2026-05-26
digitimes.com
2026-05-26
When Huawei unveiled its "Tau (τ) Scaling Law" at ISCAS 2026 in Shanghai, the announcement signalled more than another chip architecture update. It marked China's most ambitious attempt yet to redefine how semiconductor performance is measured in the post-Moore era.
2026-05-26
digitimes.com
2026-05-26
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutt
2026-05-26
marklapedus.substack.com
2026-05-26
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Huawei Describes New Chip/Design Scaling Methodology
Using this methodology, China’s Huawei plans to develop 1.4nm chips by 20
2026-05-26
natlawreview.com
2026-05-26
The National Law Review
ASAP Semiconductor Announces Its Approval as a Vendor for Austrian Airlines
ASAP Semiconductor Announces Its Approval as a Vendor for Austrian Airlines
Press Release Date 05-25-2026
A trusted partner in aviation excellence, ASAP Semiconductor’s approval as a vendor for Austrian Airlines strengthens its mission to deliver reliable aerospace supply solutions globally.
ASAP Semiconductor
2026-05-25
tomshardware.com
2026-05-25
Etiido Uko
SteamOS could still be affected
2026-05-25
www.tomshardware.com
2026-05-25
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law
News
By Etiido Uko published 11 hours ago
Flagship Huawei Mate 90 series will be the first commercial processo
2026-05-25
www.marketbeat.com
2026-05-25
MarketBeat
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2026-05-25
news.google.com
2026-05-25
Adam Tooze | Substack
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2026-05-25
www.marketbeat.com
2026-05-25
MarketBeat
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2026-05-25
worldbusinessoutlook.com
2026-05-25
World Business Outlook
Home » Scaling Sustainable Manufacturing: The Economic Impact of Advanced Packaging Technologies
Global enterprises face unprecedented regulatory scrutiny and mounting consumer demand for environmentally responsible operations. This paradigm shift fundamentally alters the economic calculus of global supply chains and manufacturing protocols.
Achieving structural Environmental, Social, and Govern
2026-05-25
www.ad-hoc-news.de
2026-05-25
AD HOC NEWS
Infineon, Shatters
Infineon Shatters 26-Year Ceiling as AI Infrastructure Boom Turns the Chipmaker into the DAX’s Hottest Stock
25.05.2026 - 08:40:42 | boerse-global.de
Infineon shares close at €73.19, a level last seen in 1999, as broad demand from AI, automotive, and industrial sectors drives 91% year-to-date gain.
Infineon Shatters 26-Year Ceiling as AI Infrastructure Boom Turns the Chipmaker
2026-05-25
www.huaweicentral.com
2026-05-25
Huawei Central
HUAWEI
Huawei Kirin 2026 Chip: 238 MTr/mm2 transistor density rivaling TSMC’s 3nm
Published
4 hours ago
on
May 25, 2026
By
Deng Li
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Huawei FreeBuds
Huawei software updates
Vivo phone updates
Huawei has revealed its Kirin 2026 details and it reveals massive upgrade in the chip arachitecture including transistor density.
He Tingbo, Director and President of Semiconductor B
2026-05-25
www.digitimes.com
2026-05-25
digitimes
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2026-05-25
www.scmp.com
2026-05-25
South China Morning Post
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2026-05-25
www.scmp.com
2026-05-25
South China Morning Post
Huawei
Tech
Huawei unveils new scaling law and tech that narrows gap with TSMC, Samsung
The Chinese tech giant’s new breakthrough is a major milestone in its mission to create a self-reliant semiconductor ecosystem
3-MIN READ
21
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Make SCMP preferred on Google
Ann Caoin ShanghaiandIris Dengin Shenzhen
Published: 9:30am, 25 May 2026Updated: 11:33am, 25 May 2026
Huawei Technologies has unveil
2026-05-25
www.huawei.com
2026-05-25
Huawei
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