Semiconductor News & Analysis Feed
22578 articles
2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
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2026-05-29
www.ad-hoc-news.de
2026-05-29
AD HOC NEWS
Infineon’s, Infrastructure
Infineon’s AI Infrastructure Play Deepens With d-Matrix Tie-Up, Even as the Stock Stretches Into Overbought Territory
29.05.2026 - 03:06:31 | boerse-global.de
Infineon's partnership with d-Matrix and GaN patent win position it at the heart of the data-center power revolution, driving a 109% YTD stock surge to €80.16.
Infineon’s AI Infrastructure Play Deepens With d-Mat
2026-05-29
www.phoronix.com
2026-05-29
Phoronix
Linux 7.2's Open-Source Nouveau Driver To Finally Support The NVIDIA GA100
Written by Michael Larabel in Nouveau on 28 May 2026 at 08:34 PM EDT. 1 Comment
Sent out today was the last drm-misc-next pull request ahead of the Linux 7.2 merge window getting underway in June. As part of this last batch of small Direct Rendering Manager graphics/accelerator driver changes is finally enabling the NVIDIA
2026-05-29
developer.nvidia.com
2026-05-29
NVIDIA Developer
AI applications are moving beyond text generation to multimodal systems that can perceive, search, and reason across images, documents, video, and language in real time—turning fragmented information into actionable insights.
Step 3.7 Flash, the latest from StepFun, brings these capabilities to production and enterprise-scale, available on NVIDIA-accelerated infrastructure. It is a 198B-paramet
2026-05-29
www.msn.com
2026-05-29
MSN
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2026-05-29
www.msn.com
2026-05-29
MSN
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2026-05-29
digitimes.com
2026-05-29
Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.
2026-05-29
digitimes.com
2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-29
digitimes.com
2026-05-29
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.
2026-05-29
digitimes.com
2026-05-29
As the global buildout of artificial intelligence infrastructure accelerates, Taiwan's technology industry has emerged as one of the most closely watched hubs in the world. Ahead of COMPUTEX 2026, Morgan Stanley held its Asia AI Summit in Taipei for the first time, underscoring the island's central role in the global semiconductor supply chain and the AI investment cycle.
2026-05-29
digitimes.com
2026-05-29
South Korean fabless chip-design company DeepX is using Computex 2026 to broaden partnerships around its neural processing units, or NPUs, as it pushes low-power AI chips for industrial and edge applications.
2026-05-29
digitimes.com
2026-05-29
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.
2026-05-29
digitimes.com
2026-05-29
The European Commission wants governments to buy chips from EU startups as Brussels seeks to reduce the bloc's reliance on US and East Asian suppliers, Reutersreported, citing a document it has seen.
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
digitimes.com
2026-05-29
C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development and scale production. The developments underscore growing investor interest in addressing power delivery bottlenecks in data centers, driven by accelerating AI workloads.
2026-05-29
digitimes.com
2026-05-29
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.
2026-05-29
digitimes.com
2026-05-29
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging as key names to watch. Supply-chain sources say the shift could reshape who captures future demand for advanced packaging.
2026-05-29
digitimes.com
2026-05-29
As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed
2026-05-29
digitimes.com
2026-05-29
Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, s
2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.