Semiconductor News & Analysis Feed

E&R Engineering says AI demand and faster-than-expected glass substrate adoption are tightening equipment supply and advancing investment plans across Asia and the US. For global chip makers, the shift could accelerate next-generation packaging capacity, reshape supplier spending, and bring advanced process tools into volume production sooner than expected.

Samsung, SK Hynix to build new chip cluster outside Seoul in $500 bn projects President Lee Jae Myung (center), Samsung Electronics Chairman Lee Jae-yong (right) and SK Group Chairman Chey Tae-won join hands at a public briefing on South Korea’s three mega projects at the Blue House on June 29, 2026 (Pool photo) Samsung Electronics Co. and SK Hynix Inc. plan to inv

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Taiwan's investment office, InvesTaiwan, under the Ministry of Economic Affairs, has approved expanded Taiwan investment plans from four companies, led by MSScorps, which will invest NT$1.5 billion (US$47.4 million) and is filing for the third time. The company plans to add production lines and adopt AI technology at its Hsinchu, Tai Yuen Hi-Tech Industrial Park, and Southern Taiwan Science Park (

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SK Hynix is reported to have held a private meeting with U.S. Deputy Secretary of State Allison Hooker, with industry sources speculating the discussions covered high-bandwidth memory cooperation with major U.S. technology firms and potential semiconductor investment expansion.

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