Semiconductor News & Analysis Feed

The advancement of AI chip technology is driving semiconductor manufacturers to adopt FOPLP (Fan-Out Panel Level Packaging) over traditional FOWLP (Fan-Out Wafer Level Packaging) to improve manufacturing efficiency. As chip sizes increase and heterogeneous integration packaging becomes more prevalen

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. This strategic move signals that next-generation packaging competition is shifting from traditional CoWoS toward more advanced solutions. T

TSMC has partnered with Ibiden and Innolux to advance glass substrate technology for its next-generation CoPoS (Chip-on-Panel-on-Substrate) advanced packaging. This shift from wafer-level to panel-level processing addresses limitations of traditional organic and silicon interposers, particularly in

Innolux stock surged following reports of a potential partnership with TSMC in FOPLP technology. Unlike AUO, which remained in the red in Q1 2026, Innolux returned to profitability with NT$1.79 billion net income, while its competitor AUO continued to report losses. This performance improvement sign