Semiconductor News & Analysis Feed
6173 articles
2026-06-25
www.globenewswire.com
2026-06-25
GlobeNewswire
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
news.google.com
2026-06-25
Stock Titan
2026-06-25
finance.yahoo.com
2026-06-25
Yahoo Finance
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Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Applied Materials, Inc.
Thu, June 25, 2026 at 6:00 AM PDT 6 min read
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Applied Materials, Inc.
Innovations spanning DRAM and advanced packaging enable the
2026-06-25
za.investing.com
2026-06-25
Investing.com South Africa
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2026-06-25
ca.investing.com
2026-06-25
Investing.com Canada
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2026-06-25
www.investing.com
2026-06-25
Investing.com
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2026-06-25
tomshardware.com
2026-06-25
Luke James
Qualcomm has announced that it will bring all four of its Dragonfly data center product lines to China.
2026-06-25
www.fastcompany.com
2026-06-25
Fast Company
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2026-06-25
www.barrons.com
2026-06-25
Barron's
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2026-06-25
www.forbes.com
2026-06-25
Forbes
LEADERSHIP
EDITORS' PICK
Forbes Daily: AI Chip Giant SK Hynix Plans A $29 Billion Nasdaq Debut
Today’s Forbes Daily covers Elon Musk’s short-lived trillionaire run, Micron soars, gold and silver reach seven-month lows, bipartisan housing bill in doubt and more.
ByDanielle Chemtob,
Forbes Staff
andForbes Daily,
Forbes Staff.
Follow Authors
Jun 25, 2026, 07:43am EDT
Elon Musk’s first run as th
2026-06-25
www.msn.com
2026-06-25
MSN
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2026-06-25
tomshardware.com
2026-06-25
Jowi Morales
Gamers and enthusiasts just can’t catch a break from the memory chip shortage.
2026-06-25
www.barrons.com
2026-06-25
Barron's
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2026-06-25
www.barrons.com
2026-06-25
Barron's
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2026-06-25
www.forbes.com
2026-06-25
Forbes
INNOVATION
AI
Whoever Wins AI Will Count Transformers, Not Nvidia Chips
ByRobert J. Szczerba,
Contributor.
Robert J. Szczerba is a tech CEO covering AI, robotics and automation
Follow Author
Jun 25, 2026, 06:15am EDT
Summary
The US AI buildout faces a critical bottleneck: not chips, but power infrastructure. Half of planned 2026 data centers are stalled due to shortages of transformers, switc
2026-06-25
finimize.com
2026-06-25
Finimize
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2026-06-25
eetimes.com
2026-06-25
IBM unveils 0.7-nm nanostack chips promising 100 billion transistors, denser SRAM, and production within five years.
2026-06-25
newsroom.ibm.com
2026-06-25
IBM Newsroom
YORKTOWN HEIGHTS, NY, June 25, 2026 – IBM (NYSE: IBM) today unveiled a major semiconductor breakthrough with the introduction of the world’s first sub-1 nanometer (nm) chip technology, featuring a revolutionary transistor architecture at the 0.7 nm, or 7 angstrom node. The achievement marks a landmark moment for an industry facing the physical limits of traditional chip scaling. Semiconductors pla
2026-06-25
siliconangle.com
2026-06-25
SiliconANGLE
IBM Corp. today unveiled what it says is the world’s first sub-one-nanometer chip technology, a research breakthrough that it said will fuel the next 10 years of semiconductor development and pave the way to atomic-level chip design.
The new technology is based on a transistor architecture IBM calls nanostack, designed for the 0.7-nanometer, or seven-angstrom, node. IBM said the architecture can
2026-06-25
research.ibm.com
2026-06-25
IBM Research
This new microchip architecture from IBM builds up, not out, to overcome the spatial limitations of scaling transistor density.
Learn more about IBM's newest breakthrough, the sub-1 nanometer chip.
Since the advent of microprocessors, semiconductor manufacturers have tried to pack more and more transistors into a given area to boost the performance capabilities of machines. Infinite growth is tr