Semiconductor News & Analysis Feed
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2026-07-10
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2026-07-10
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2026-07-10
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2026-07-10
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2026-07-10
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2026-07-10
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2026-07-10
digitimes.com
2026-07-10
TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.
2026-07-10
digitimes.com
2026-07-10
For most of its modern history, India's Northeast — the eight states anchored by Assam — has sat at the margins of the country's industrial economy. That is beginning to change, as a mix of federal industrial incentives, a flagship semiconductor packaging plant in Assam, and deepening ties with Japan give the region a modest but real foothold in India's electronics ambitions.
2026-07-10
eetimes.com
2026-07-10
Alan Patterson
Apple’s $30B Broadcom bet drags AI data centers and U.S. chipmaking into its orbit… and may hand Intel a lifeline.
2026-07-10
digitimes.com
2026-07-10
A veteran chip engineer turned venture capitalist used a panel at Taipei's Asia VC Summit on Wednesday to challenge two of the semiconductor industry's most fashionable narratives: that AI will solve chip design, and that co-packaged optics (CPO) is ready for prime time.