Semiconductor News & Analysis Feed

3 articles

2026-06-17

TSMC Bets on Glass for CoWoS as Silicon-Mimicking Thermals Beat Organic Substrates, Yet Mass Production Stays Distant - Wccftech

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wccftech.com 2026-06-17 Wccftech

The Taiwan Semiconductor Manufacturing Company (TSMC) is expanding its supply chain for glass substrates as part of the first step of establishing a supply chain for the chip-on-panel-on-substrate (CoPoS) packaging technology, according to supply chain sources. The glass substrates will be used in the firm's advanced versions of the chip-on-wafer-on-substrate (CoWoS) packaging technology, and TSMC

Semiconductor Packaging CoWoS Technology Glass Substrate Silicon Thermal Characteristics Organic Substrate Supply Chain Expansion Chip Stacking Advanced Packaging

2026-06-04

Tianyue Advanced Materials rose as overseas SiC giants initiated a second round of price increases; the company is a leading producer of 8-inch SiC substrates. - Moomoo

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www.moomoo.com 2026-06-04 Moomoo

消息面上，随着英伟达等AI芯片功耗飙升，传统硅基电源架构已触及物理极限。行业正加速向800V高压直流(HVDC)架构过渡，碳化硅成为AI服务器固态变压器及电源管理的必选材料。英飞凌、意法半导体等巨头明确表示，AI数据中心的部署导致多款功率器件出现严重供应短缺。公开资料显示，天岳先进在8英寸碳化硅衬底领域占据全球领先份额，12英寸完成样品研发、送样、小批量试样供货。据悉，天岳先进的12英寸SiC衬底进入台积电供应链验证阶段，作为下一代CoWoS中介层备选方案开展送样测试。用作替代硅中介层以解决高性能GPU的散热瓶颈。 Tianyue Advanced Materials (02631.HK) rose nearly 7% in early trading. As of the time of writing, it was up 3.27% at HK$104.1, with a tr

Silicon Carbide SiC Substrate 8-inch SiC 12-inch SiC AI Chip Power Device HVDC Architecture TSMC Supply Chain

2026-06-04

Tianyue Advanced Materials rose as overseas silicon carbide (SiC) giants initiated a second round of price hikes; the company is a leading producer of 8-inch SiC substrates. - 富途牛牛

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news.futunn.com 2026-06-04 富途牛牛

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