Semiconductor News & Analysis Feed
11021 articles
2026-07-10
digitimes.com
2026-07-10
Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company's advantages in common packaging optics (CPO) amid market attention on Corning's Glass Bridge technology.
2026-07-10
digitimes.com
2026-07-10
Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence analyst Luke Lin examined the actual progress of advanced-node capacity expansion at TSMC, Intel, and Samsung, arguing that market expectations in several areas have run ahead of reality.
2026-07-10
digitimes.com
2026-07-10
Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening a new front in the competition over advanced memory performance, yield and supply.
2026-07-10
digitimes.com
2026-07-10
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging and leading-edge manufacturing equipment at the same time.
2026-07-10
digitimes.com
2026-07-10
Nvidia CEO Jensen Huang will travel to Japan for an event celebrating the US chipmaker's three-decade relationship with Sega, revisiting a partnership that helped Nvidia survive its difficult early years as semiconductor competition expands from data centers to personal computers.
2026-07-10
digitimes.com
2026-07-10
Apple and Broadcom have extended their custom-chip partnership through 2031 under agreements expected to exceed US$30 billion, reinforcing Broadcom's position as a critical Apple chip supplier.
2026-07-10
digitimes.com
2026-07-10
A veteran chip engineer turned venture capitalist used a panel at Taipei's Asia VC Summit on Wednesday to challenge two of the semiconductor industry's most fashionable narratives: that AI will solve chip design, and that co-packaged optics (CPO) is ready for prime time.
2026-07-10
digitimes.com
2026-07-10
For most of its modern history, India's Northeast — the eight states anchored by Assam — has sat at the margins of the country's industrial economy. That is beginning to change, as a mix of federal industrial incentives, a flagship semiconductor packaging plant in Assam, and deepening ties with Japan give the region a modest but real foothold in India's electronics ambitions.
2026-07-10
digitimes.com
2026-07-10
GlobalWafers and Micron have signed a 10-year supply agreement, alongside US$500 million in strategic financial support, in a move that underscores how artificial intelligence (AI), high-performance computing (HPC), data centers, and advanced memory demand are reshaping semiconductor sourcing. The deal extends US supply chain localization beyond wafer production and into upstream critical material
2026-07-10
digitimes.com
2026-07-10
GigaDevice Semiconductor expects first-half 2026 net profit to reach about CNY6.9 billion (US$960 million), a 1,099% increase from a year earlier, after tight memory chip supply lifted both shipment volumes and prices.
2026-07-10
digitimes.com
2026-07-10
Realtek Semiconductor reported June 2026 revenue of NT$12.31 billion (approx. US$383.67 million), down 1.7% from the previous month but up 20.6% from a year earlier. Second-quarter 2026 revenue totaled NT$37.55 billion, rising 3.11% sequentially and 17.68% year-over-year, while first-half 2026 revenue reached NT$73.98 billion, up 10.52% from the same period last year. Both second-quarter and first
2026-07-10
digitimes.com
2026-07-10
ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor materials, marking a significant step toward commercializing technologies widely viewed as essential for extending Moore's Law beyond the limits of conventional silicon scaling.
2026-07-10
digitimes.com
2026-07-10
As cloud service providers (CSPs) continue to ramp up capital expenditures, demand for high-speed interconnects within data centers is accelerating. Multiple research firms forecast that leading CSPs will sustain high double-digit capex growth in 2026, with roughly half of the increase driven by data center expansion.
2026-07-10
digitimes.com
2026-07-10
ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and testing, conventional backend services and AI-related applications. June revenue reached its second-highest monthly level on record, while quarterly growth exceeded the company's previous guidance.
2026-07-10
digitimes.com
2026-07-10
LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to expand capacity for advanced packaging products used in AI servers and high-end mobile devices.
2026-07-10
digitimes.com
2026-07-10
Global Mixed-mode Technology reported June revenue of NT$743 million (US$23.16 million), down 0.71% from May but up 7.19% from a year earlier. The Taiwanese PMIC maker said second-quarter revenue reached NT$2.238 billion, up 5.99% from the first quarter and down 0.46% year on year, while first-half revenue totaled NT$4.349 billion, a 1.30% decline from a year earlier.
2026-07-10
www.indexbox.io
2026-07-10
IndexBox
2026-07-10
www.investors.com
2026-07-10
Investor's Business Daily
2026-07-10
www.foxbusiness.com
2026-07-10
Fox Business
2026-07-10
news.google.com
2026-07-10
KSLA