33 articles
2026-05-23
news.google.com 2026-05-23 Yahoo Finance Singapore
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2026-05-23
www.hpcwire.com 2026-05-23 HPCwire
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2026-05-22
www.techpowerup.com 2026-05-22 TechPowerUp
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2026-05-22
www.techpowerup.com 2026-05-22 TechPowerUp
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2026-05-22
digitimes.com 2026-05-22
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng
2026-05-22
digitimes.com 2026-05-22
Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads. The hardware targets a narrow segment of service providers that operate premium, high-velocity token applications for select customer bases. While the architecture excels at rapid text decoding, its broader market
2026-05-22
eetimes.com 2026-05-22
AMD to invest more than $10 billion in Taiwan ecosystem, ramping HPC chips on TSMC’s 2-nm process amid AI buildout.
2026-05-21
wccftech.com 2026-05-21 Wccftech
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2026-05-21
news.google.com 2026-05-21 HPCwire
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2026-05-21
www.techpowerup.com 2026-05-21 TechPowerUp
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2026-05-21
www.techpowerup.com 2026-05-21 TechPowerUp
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2026-05-20
www.hpcwire.com 2026-05-20 HPCwire
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2026-05-20
www.hpcwire.com 2026-05-20 HPCwire
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2026-05-18
digitimes.com 2026-05-18
China's semiconductor equipment localization campaign is entering a more demanding phase, shifting from proving that domestic alternatives can work to showing they can meet the reliability, throughput, and yield requirements of production-scale manufacturing.
2026-05-17
digitimes.com 2026-05-17
Singapore-based AI automation startup Galatek said it is tackling yield bottlenecks in micron-level packaging with AI-embedded equipment as demand for AI and high-performance computing (HPC) chips surges across Southeast Asia and global markets. The company is also pursuing a dual-track expansion spanning Southeast Asia and Taiwan.
2026-05-16
www.marktechpost.com 2026-05-16 MarkTechPost
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2026-05-14
www.techpowerup.com 2026-05-14 TechPowerUp
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2026-05-13
www.techpowerup.com 2026-05-13 TechPowerUp
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2026-05-12
www.techpowerup.com 2026-05-12 TechPowerUp
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2026-05-12
www.business-standard.com 2026-05-12 Business Standard
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