Cadence, HPE Partner for AI Data Center Modernisation with Digital Twins - Indiatimes

Cadence and HPE have announced a strategic partnership to advance AI data center modernization, marking a significant development in the semiconductor industry's AI infrastructure journey. The collabo... Read original →

Cadence and HPE’s integration of digital twins into AI data center workflows represents a strategic leap: EDA capabilities are evolving from chip design aids into infrastructure intelligence layers. This move pressures Synopsys and Ansys in multi-physics co-simulation and accelerates adoption of advanced packaging and optical interconnects by demanding real-time thermal, power, and latency modeling. Tightening U.S.-EU AI compute export controls heighten data sovereignty risks and localization costs for global twin deployments. NVIDIA may counter with Omniverse-based solutions, while ODMs like Supermicro risk disintermediation. Within 18 months, the industry will see a standards battle across chip-rack-cluster digital twin layers. India’s ambition to become an AI infrastructure hub hinges on bridging its semiconductor manufacturing gap and reducing IP core dependencies.