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By Heekyong Yang SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher. The South Korean ​tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its

Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.

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FuriosaAI and Broadcom have partnered to build a high-performance AI accelerator chip featuring next-gen HBM4/E memory. FuriosaAI has announced its third-generation AI accelerator, which builds upon its 2nd Generation RNGD platform, which is currently in mass production on TSMC's 5nm process technology. The 2nd Gen RNGD AI platform comes in the form of a 180W PCIe-based design, which aims at LLM

Micron's sixth-generation high bandwidth memory (HBM4) production ramp-up is progressing smoothly. (Photo: Micron) Micron Technology's ramp-up of sixth-generation high bandwidth memory (HBM4) production capacity is progressing smoothly. The company also plans to begin mass production of next-generation HBM4E standard products next year. Manish Bhatia, executive vice president of global operation

Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products driving growth through 2027. The company is expanding EUV adoption,... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time the

Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products driving growth through 2027. The company is expanding EUV adoption, deepening collaboration with customers and foundry partners, and using multi-year supply agreements to support future capacity investments.

Product Pricing Company Resources Blog Sign In Free Sign Up EN English Español Português 日本語 한국어 Deutsch Italiano Français 中文 (中国) General Investing Micron HBM4 Is Ramping Twice as Fast as Expected. Here’s What That Means for Investors Wiltone Asuncion • 8 minute read Reviewed by: David Hanson Last updated May 22, 2026 Share copy link Key Stats for Micron Technology Stock Current Price: $762.10 Ta

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Samsung Electronics became the first chipmaker to mass-produce and ship sixth-generation high-bandwidth memory chips in February — the component that Nvidia, AMD, and Google are competing to secure for their next-generation AI accelerators — whilenegotiations with more than 50,000 workers collapsed this week, leaving a threatened 18-day strike starting May 21 as the single biggest near-term risk t

Samsung Electronics' foundry business is showing signs of recovery after a prolonged downturn, as AI chip projects and HBM4-related demand begin to raise utilization at its advanced-process lines.The article requires paid subscription.Subscribe Now