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China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration - digitimes

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www.digitimes.com 2026-09-03

Chinese advanced packaging provider SJ Semiconductor (SJSemi) has made a significant advancement in 2.5D packaging technology, expanding its silicon-interposer-based platform to 3.3 times the standard reticle size. This innovation enables denser integration of multiple dies and high-bandwidth memory

Semiconductor Packaging 2.5D Packaging Silicon Interposer AI Chips High-Bandwidth Memory Advanced Packaging Reticle Size Chip Integration

Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration - Tom's Hardware

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www.tomshardware.com 2026-06-10

According to The Information, Google has reportedly placed an order with Intel for over three million TPUs in 2028, marking a significant endorsement of Intel's advanced packaging technology. This move follows months of testing Intel's EMIB (Embedded Multi-Die Interconnect Bridge) technology, and it

Google Intel TPU EMIB packaging HBM AI chip Semiconductor manufacturing TSMC

Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration - Tom's Hardware

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www.tomshardware.com 2026-05-11

Following reports of a partnership between Intel and SK hynix to develop 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology for high-bandwidth memory (HBM) integration, both companies' stock prices surged significantly. SK hynix hit an intraday high of $1,320, up 1

Semiconductor packaging High-bandwidth memory EMIB technology Chip manufacturing SK hynix Intel AI data centers Memory market

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