Semiconductor News & Analysis Feed
735 articles
2026-07-03
www.tomshardware.com
2026-07-03
Tom's Hardware
PC Components RAM DRAM
Inside the history of DRAM price-fixing lawsuits — how HBM allocations could make a difference after two decades of failed cases
News-analysis
By Luke James
Published July 3, 2026
Garciaguirre v. Samsung leans on HBM to prove an agreement that federal courts have twice declined to see in parallel production cuts.
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2026-07-03
finance.biggo.com
2026-07-03
finance.biggo.com
The benefits of the semiconductor supercycle are spreading to the backend industry, with inspection equipment component maker TSE emerging as a standout in the probe card market for High Bandwidth Memory (HBM). The company's strategic shift from a NAND flash-centric portfolio to HBM has become the key driver simultaneously lifting its stock price and earnings outlook.
2026-07-03
www.moomoo.com
2026-07-03
Moomoo
__fail__
2026-07-03
digitimes.com
2026-07-03
Samsung Electronics is moving closer to commercialising HBM4E, its seventh-generation high-bandwidth memory (HBM), after internal testing showed reliability yields above 70%, strengthening its bid to gain ground in the AI memory market.
2026-07-03
biz.chosun.com
2026-07-03
Chosunbiz
By
Kwon Woo-seok
Published 2026.07.03. 08:27
Brokerages are raising their target prices for Samsung Electronics ahead of its earnings release on the 7th. While short-term results may dip slightly due to recognition of labor-management compensation expenses, analysts said attention should be on the recovery of high-bandwidth memory (HBM) competitiveness and improved long-term profitability.
Lee
2026-07-03
www.techradar.com
2026-07-03
TechRadar
Pro
Anthropic's Claude to help Micron design better HBM, DRAM, and SSD for AI even as both companies refuse to address computational storage directly
News
By Rahim Amir
Published July 3, 2026
AI-designed solutions for AI-designated consumption?
(Image credit: Anthropic)
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2026-07-03
newsletter.semianalysis.com
2026-07-03
SemiAnalysis
EMIB-T Roadmap, Custom HBM, HBM4 Packaging Challenges, Microfluidic Cooling, Photonic Interconnects, and More
ECTC 2026 Roundup, Intel, TSMC, SK Hynix, Samsung, Micron, Marvell, Lightmatter, Microsoft
AFZAL AHMAD, DC, GERALD WONG, AND DYLAN PATEL
JUL 03, 2026
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As transistor density scaling has slowed, advanced packaging has become the primary scaling vector. However, AI acceler
2026-07-02
www.tradingview.com
2026-07-02
TradingView
News
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Zacks
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Cohu Is Riding AI and HBM Trends But Execution Still Matters
Cohu Is Riding AI and HBM Trends But Execution Still Matters
3 min read
COHU
+2.75%
Cohu, Inc. COHU is becoming a more visible small-cap play on semiconductor test demand tied to AI infrastructure.
The story is not just about equipment shipments. It also involves high-bandwidth memory inspection, thermal control, softwar
2026-07-02
finance.yahoo.com
2026-07-02
Yahoo Finance
Cohu Is Riding AI and HBM Trends But Execution Still Matters
Cohu, Inc. Price and Consensus · Zacks
Anirudha Bhagat
Thu, July 2, 2026 at 6:48 AM PDT 3 min read
COHU
+2.26%
TER
+2.47%
ADTTF
-16.75%
ATEYY
+0.80%
Explore stocks on Coinbase
Trading disclosure
Cohu, Inc. COHU is becoming a more visible small-cap play on semiconductor test demand tied to AI infrastructure.
The story is not just about
2026-07-02
www.zacks.com
2026-07-02
Zacks Investment Research
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2026-07-02
www.mk.co.kr
2026-07-02
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2026-07-02
www.weex.com
2026-07-02
WEEX
Expect a clear look at how the AI-driven memory cycle and a structural HBM bottleneck could shape SK Hynix’s trajectory through 2027. We’ll break down the supply constraints that matter most, map bull/base/bear scenarios, and outline practical ways to trade price exposure without stock ownership. If you favor crypto-native rails, the WEEX SKHYNIX-USDT futures listing offers 24/7 access to SK Hynix
2026-07-02
www.koreatimes.co.kr
2026-07-02
The Korea Times
Two headlines in June should shape Korea’s artificial intelligence (AI) debate. The first was a victory lap. SK hynix overtook Samsung Electronics by common-share market capitalization for a day, powered by high-bandwidth memory (HBM) chips used in AI systems. Samsung has a fair caveat: If preferred shares are included, it remains larger. But the market signal was clear. AI has turned memory from
2026-07-02
letsdatascience.com
2026-07-02
Let's Data Science
INDUSTRY APPLICATIONS
kaist
ai agents
hbm
design automation
KAIST Showcases AI Agents for HBM Design Automation
1 sources
|
July 2, 2026
|
By LDS Team
5.3
Relevance Score
Photo: newsimg.koreatimes.co.kr · rights & takedowns
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KAIST's TERALab, led by electrical engineering professor Kim Joung-ho, will host a public workshop on July 3, 2026 showcasing AI agents that automate high-b
2026-07-02
www.koreatimes.co.kr
2026-07-02
The Korea Times
Kim Joung-ho, third from left, an electrical engineering professor at the Korea Advanced Institute of Science and Technology (KAIST), lectures students at the university’s campus in Daejeon. Courtesy of KAIST
The Korea Advanced Institute of Science and Technology (KAIST) will showcase on Friday artificial intelligence (AI) agents capable of automating high-bandwidth memory (HBM) design, offering
2026-07-02
biz.chosun.com
2026-07-02
Chosunbiz
By
Hwang Min-gyu
Published 2026.07.02. 11:12
Lee Jae-yong, chair of Samsung Electronics, delivers a welcome address at the national briefing on the Chungcheong advanced industry development vision presided over by President Lee Jae-myung in Asan, South Chungcheong, on the 2nd. /Courtesy of Yonhap News
Samsung said on the 2nd at the Chungcheong Advanced Industry Development Vision national briefi
2026-07-02
en.yna.co.kr
2026-07-02
Yonhap News Agency
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SEOUL, July 2 (Yonhap) -- An industrywide 392 trillion-won (US$252.5 billion) investment will be injected into the central Chungcheong area, including high bandwidth memory (HBM) fabs and packaging facilities by Samsung Electronics Co. and SK hynix, as part of the government's drive to spread artificial intell
2026-07-02
letsdatascience.com
2026-07-02
Let's Data Science
INFRASTRUCTURE
hbm packaging
semiconductor investment
south korea
semiconductors
Samsung and SK hynix Build HBM Packaging Fabs
15 sources
|
July 2, 2026
|
By LDS Team
7.4
Relevance Score
Photo: newsimg.koreatimes.co.kr · rights & takedowns
QUICK SUMMARY
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Samsung Electronics and SK hynix will build new high-bandwidth memory (HBM) packaging fabs in South Korea's Chungcheong region as part of a
2026-07-02
www.koreaherald.com
2026-07-02
The Korea Herald
This undated file photo shows SK hynix Inc.'s factory in Cheongju, 113 kilometers south of Seoul. (SK hynix Inc.)
An industrywide 392 trillion-won ($252.5 billion) investment will be injected into the central Chungcheong area, including high bandwidth memory fabs and packaging facilities by Samsung Electronics Co. and SK hynix, as part of the government's drive to spread artificial intelligence-l
2026-07-02
www.koreatimes.co.kr
2026-07-02
The Korea Times
An artist's rendering of SK hynix's P&T7 packaging fab in Cheongju, North Chungcheong Province / Courtesy of SK hynix
An industrywide 392 trillion-won ($252.5 bil.) investment will be injected into the central Chungcheong area, including high bandwidth memory (HBM) fabs and packaging facilities by Samsung Electronics and SK hynix, as part of the government's drive to spread artificial intelligenc