Semiconductor News & Analysis Feed
738 articles
2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
technode.global
2026-05-26
TNGlobal
SK hynix unveils ‘iHBM’ thermal solution to boost AI performance
MAY 26, 2026|BY LIUTENG
Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility
SEOUL
2026-05-26
www.techpowerup.com
2026-05-26
TechPowerUp
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2026-05-26
biz.chosun.com
2026-05-26
Chosunbiz
By
Hwang Min-gyu
Published 2026.05.26. 09:13
A concept diagram of iHBM technology released by SK hynix. /Courtesy of SK hynix
SK hynix unveiled next-generation technology that reduces heat by inserting a cooling element inside a high bandwidth memory (HBM) package.
On the 26th, SK hynix said it introduced "iHBM," a technology that embeds an integrated cooling element, ICE, in an HBM package. IC
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.
2026-05-26
digitimes.com
2026-05-26
Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products.
2026-05-26
www.prnewswire.com
2026-05-26
PR Newswire
SK hynix unveils 'iHBM' thermal solution to boost AI performance
NEWS PROVIDED BY
SK hynix Inc.
May 25, 2026, 19:39 ET
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Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–
2026-05-26
markets.ft.com
2026-05-26
Financial Times
SEOUL, South Korea , May 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.
[1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-
2026-05-26
sg.finance.yahoo.com
2026-05-26
Yahoo Finance Singapore
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2026-05-25
news.futunn.com
2026-05-25
富途牛牛
As artificial intelligence workloads continue to expand, demand for memory capacity and bandwidth is growing rapidly, pushing existing GPU-HBM architectures toward their limits. According to ZDNet, researchers at a major South Korean memory manufacturer stated that memory and packaging companies are exploring a new approach that places the GPU and HBM in separate packages. Unlike traditional desig
2026-05-25
www.thelec.net
2026-05-25
thelec.net
Micron's sixth-generation high bandwidth memory (HBM4) production ramp-up is progressing smoothly. (Photo: Micron)
Micron Technology's ramp-up of sixth-generation high bandwidth memory (HBM4) production capacity is progressing smoothly. The company also plans to begin mass production of next-generation HBM4E standard products next year.
Manish Bhatia, executive vice president of global operation
2026-05-25
wccftech.com
2026-05-25
Wccftech
US memory giant Micron believes that the shortage in the memory market when it comes to HBM, NAND and DRAM products will last well beyond calendar year 2026. Micron's thoughts were shared by JPMorgan in an investment note where the bank shared insights that the firm's management shared at the 54th J.P. Morgan Annual Global Technology, Media and Communications (TMC) Conference held in Boston, Massa
2026-05-25
www.digitimes.com
2026-05-25
digitimes
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products driving growth through 2027. The company is expanding EUV adoption,...
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2026-05-25
digitimes.com
2026-05-25
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products driving growth through 2027. The company is expanding EUV adoption, deepening collaboration with customers and foundry partners, and using multi-year supply agreements to support future capacity investments.
2026-05-24
en.sedaily.com
2026-05-24
Seoul Economic Daily
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2026-05-24
en.sedaily.com
2026-05-24
Seoul Economic Daily
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2026-05-24
en.sedaily.com
2026-05-24
Seoul Economic Daily
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2026-05-23
wccftech.com
2026-05-23
Wccftech
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iPhone 20 Renders Reveal Apple’s Next-Generation Design, With Details Like Silicon-Anode Battery, A21 SoC, HBM RAM & More Mentioned
Omar Sohail
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May 23, 2026 at 03:50am EDT
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This could be your first look at Apple's 20th-anniversary release / Image credits - FPT
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2026-05-22
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2026-05-22
GuruFocus
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2026-05-22
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2026-05-22
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General Investing
Micron HBM4 Is Ramping Twice as Fast as Expected. Here’s What That Means for Investors
Wiltone Asuncion
•
8 minute read
Reviewed by:
David Hanson
Last updated May 22, 2026
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Current Price: $762.10
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