Semiconductor News & Analysis Feed
735 articles
2026-07-14
digitimes.com
2026-07-14
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.
2026-07-14
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2026-07-14
digitimes
2026-07-14
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2026-07-14
thelec.net
2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-14
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2026-07-13
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2026-07-13
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2026-07-13
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2026-07-13
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2026-07-13
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2026-07-13
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2026-07-13
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2026-07-13
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2026-07-13
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2026-07-13
digitimes
2026-07-13
digitimes.com
2026-07-13
GPUs have dominated AI infrastructure discussions over the past two years, powering everything from large language model (LLM) training and inference clusters to high-bandwidth memory (HBM), advanced packaging, and liquid-cooled server racks. As the industry races to expand computing capacity, GPUs have largely defined the conversation. That dynamic, however, may be beginning to change as CPUs div
2026-07-13
digitimes.com
2026-07-13
SK Hynix began mass-production shipments of 12-layer HBM4 to Nvidia at the end of June and is increasing output ahead of a broader ramp, The Bellreported, citing semiconductor industry sources.
2026-07-13
digitimes.com
2026-07-13
AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at the centre of this week's tech agenda.
2026-07-13
digitimes.com
2026-07-13
SK hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging density, thermal control, and tighter integration with AI accelerators.