Semiconductor News & Analysis Feed
20 articles
2026-08-03
2026-07-31
2026-07-29
2026-07-29
2026-07-25
www.digitimes.com
2026-07-25
Intel's strategic collaboration with Lens Technology to explore glass substrate semiconductor packaging represents a significant advancement in advanced packaging technologies. Glass substrates offer superior electrical and thermal performance, enabling enhanced chip integration and performance. Thi
2026-07-25
2026-07-24
finance.biggo.com
2026-07-24
Lens Technology and Intel have announced a strategic partnership to jointly explore the application of Through-Glass Via (TGV) technology in next-generation advanced packaging. This collaboration marks Lens Technology's strategic expansion from consumer electronics precision manufacturing into the s
2026-07-18
2026-07-13
news.google.com
2026-07-13
2026-07-13
news.google.com
2026-07-13
2026-07-13
news.google.com
2026-07-13
2026-07-13
news.google.com
2026-07-13
2026-07-10
2026-07-08
www.moomoo.com
2026-07-08
As demand for AI and high-performance computing continues to rise, advanced packaging technologies are becoming a critical component of the semiconductor supply chain. Recently, Goldman Sachs maintained a cautious stance on Taiwan Semiconductor Manufacturing Company's (TSMC) progress in glass core s
2026-06-24
2026-06-22
www.digitimes.com
2026-06-22
According to recent DIGITIMES reporting, despite significant market attention surrounding glass substrate technology in semiconductor packaging, TSMC's commercial rollout is now expected to be delayed until 2030. This technology development pace significantly lags behind market hype, indicating real
2026-06-22
2026-06-18
biz.chosun.com
2026-06-18
Taiwan Semiconductor Manufacturing Company (TSMC) has disclosed verification results for glass substrates, signaling a strategic acceleration in next-generation semiconductor packaging. These substrates are expected to overcome limitations of traditional plastic-based materials, particularly in warp
2026-06-16
www.digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. This strategic move signals that next-generation packaging competition is shifting from traditional CoWoS toward more advanced solutions. T
2026-06-16
www.tradingkey.com
2026-06-16
TSMC has partnered with Ibiden and Innolux to advance glass substrate technology for its next-generation CoPoS (Chip-on-Panel-on-Substrate) advanced packaging. This shift from wafer-level to panel-level processing addresses limitations of traditional organic and silicon interposers, particularly in