Semiconductor News & Analysis Feed
173 articles
2026-06-22
finance.yahoo.com
2026-06-22
Yahoo Finance
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Micron and Anthropic Announce Strategic Agreement to Scale Next-Generation AI Infrastructure
Micron Technology, Inc.
Mon, June 22, 2026 at 6:00 AM PDT 3 min read
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Micron Technology, Inc.
Collaboration spans memory and storage AI architecture design, su
2026-06-22
news.futunn.com
2026-06-22
富途牛牛
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2026-06-22
www.moomoo.com
2026-06-22
Moomoo
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2026-06-22
digitimes.com
2026-06-22
Nvidia's planned US$20 billion strategic deal with Groq is built on a simple logic: as compute gets cheaper, demand keeps expanding. In a recent interview, Groq co-founder and CEO Jonathan Ross explained why Nvidia is expected to combine Groq's LPU with its latest Vera Rubin platform and how GPU and LPU can work as complementary engines in LLM inference.
2026-06-22
digitimes.com
2026-06-22
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies. The appointment also represents another strategic move by Intel CEO Lip-Bu Tan to reorganize the company's foundry business.
2026-06-20
tomshardware.com
2026-06-20
Hassam Nasir
Another person has fallen victim to Amazon's generous return policy, as they received a disc drive, a mousepad, and an AV receiver instead of the $700 RTX 5070 they ordered.
2026-06-20
digitimes.com
2026-06-20
Efinix, a Cupertino-based FPGA startup founded in 2012, is making a push into edge AI with its newly launched Titanium Edge series — a family of chips the company says addresses longstanding power and security limitations in programmable logic devices.
2026-06-19
digitimes.com
2026-06-19
Samsung Electronics' foundry business has signed a strategic manufacturing collaboration with Claros, a US power-management startup, to produce semiconductors designed to cut energy waste inside AI data centers, according to a Claros announcement and a report by ZDNet Korea.
2026-06-18
semiengineering.com
2026-06-18
Semiconductor Engineering
As logic devices transition from FinFETs to more complex gate-all-around (GAA) architectures, manufacturing variability has become a major barrier to achieving high yield.1,2 Hundreds of tightly coupled process steps now contribute to yield loss, making traditional wafer-based optimization slow, expensive, and often limited to addressing one failure mode at a time.3,4,5
To overcome these challeng
2026-06-18
www.indexbox.io
2026-06-18
IndexBox
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2026-06-18
www.moomoo.com
2026-06-18
Moomoo
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2026-06-18
digitimes.com
2026-06-18
Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.
2026-06-18
digitimes.com
2026-06-18
Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic and memory devices.
2026-06-16
tspasemiconductor.substack.com
2026-06-16
semivision
Japan’s Strategic Position in the Semiconductor Industry in the AI Era
Origianl Article By SemiVision Research [Reading time: 46 mins]
SEMIVISION
JUN 16, 2026
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Japan’s Strategic Position in the Semiconductor Industry in the AI Era
The History and Overall Positioning of Japan’s Semiconductor Industry
Japan is an important participant in the global semiconductor industry. After re
2026-06-16
www.openpr.com
2026-06-16
openPR.com
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2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
digitimes.com
2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
digitimes.com
2026-06-16
Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing toward pilot production and mass manufacturing.
2026-06-16
digitimes.com
2026-06-16
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used in semiconductor manufacturing. Limited short-term supply additions and low industry inventories are widening the supply-demand gap, triggering a rapid price increase.